We talk lasers in the microLED industry with Bolite Optoelectronics' CEO

The founder and General Manager of Bolite Optoelectronics, Dr. Bowen Cheng, was invited to present at the recent Touch Taiwan 2021 Conference in April. The title of his talk was “Laser Processing Applications for the Manufacturing of Mini and MicroLED Displays.” Since it was presented in Mandarin only, microled-info.com caught up with Dr. Cheng to learn more about this trending subject and the company he started.

Laser repair equipment for TFT arrays (Bolite in partnership with Contrel Technology)

Q: Dr. Cheng, can you please tell us a little about your background, prior to starting Bolite?

I was a research engineer at Xerox PARC and helped develop surface micromachined microspring interconnects in a project funded by the U.S. Army Research in collaboration with Oracle. I was also a vital member of the team that successfully demonstrated the world’s shortest wavelength diode laser at the time, a 250 nm UV laser for military applications. With these experiences in both semiconductor laser processing and MEMS processing, I decided to start Bolite and build a team to develop state-of-the-art laser solutions for microprocessing applications.

Q: I must admit I’ve not heard of Bolite before. What differentiates you from other laser microprocessing companies?

ETRI researchers develop a novel method to produce microLEDs using a new film material

Researchers from Korea's Electronics and Telecommunications Research Institute (ETRI) developed a new process to produce microLED displays, which they say can be highly cost effective.

MicroLED production using SITRAB (ETRI)

The new process is based on a novel film-like material developed at ETRI, called SITRAB. Using lasers, the process apparently detaches the microLED from the original epiwafer and bonds it to the SITRAB film in the same process step. The LEDs are then transferred to the final target backplane.

3D-Micromac launches a new microLED LIFT mass transfer tool

3D-Micromac announced a new microLED mass transfer tool, called microCETI. The company says its new technology can be used to transfer over 130 million microLEDs per hour.

MicroCETI is based on a laser-induced forward transfer (LIFT) process that can support almost any microLED material and shape. The tool also includes optional modules - a laser lift-off (LLO) module, and a single LED die repair module.

Rohinni designed a parallel-design for its miniLED bondhead equipment to achieve 14X placement speed boost

Micro-LED and mini-LED developer Rohinni announced that the company has developed a new design for its miniLED composite bondhead, which now allows multiple bondheads to run in parallel. Rohinni says it has been able to accelerate its miniLED deposition speed 14X compared to 'competing technologies'.

Rohinni miniLED bondhead deposition photo

With the new system, Rohinni demonstrated >99.999% placement yield and scalability at speeds< greater than 100 die per second. said that it developed a new placement technology for mini-LED that doubles the placement speed compared to its previous technology.

eLux installs a new automated fluidic assembly R&D tool, unveils a new microLED display prototype

USA-based eLux was established in 2016 as a spin-off from Sharp Labs of America, to commercialize a unique MicroLED production technology. A year ago we discussed the company's technology and business with its CEO, Jong-Jan Lee.

eLux automated fulidic assembly tool, 2021

Today eLux announced that it has installed an automated fluidic assembly tool at its prototype fab in Taiwan. The new tool features fully automatic cassette-to-cassette fluidic assembly of ten display panels, each up to 15-inch in size. The tool has provisions for capture and recycle of microLEDs and assembly fluids to minimize operating costs, and its capacity can be expanded by adding two additional modules.

STRATACACHE CEO details the challenges and goals of the company's upcoming US-based microLED display production fab

Global digital signage solution provider STRATACACHE is constructing the first US-based complete display production facility in Eugene, Oregon. The future MicroLED E4 fab is planned to commence production in 2022, and the fab will be a complete microLED production line, from epiwafer (on 300 mm silicon wafers), through transfer process and to final module assembly.

STRATACACHE Eugene E4 MicroLED fab photo

This project is extremely interesting, and we set out to discuss it with STRATACACHE's founder and CEO, Chris Riegel. At STRATACACHE, Chris leads strategic direction, technology development and engineering operations, and the MicroLED fab project seems to be personally spearheaded by him.

Kulicke & Soffa acquires microLED placement technology developer Uniqarta

Singapore-based electronics assembly solutions provider Kulicke & Soffa announced that it has acquired Uniqarta, a US-based developer of MicroLED placement technology.

Uniqarta LEAP microLED placement technology illustration

Uniqarta developed a unique LED die transfer technology that uses ultra-fast lasers to enable contactless LED de-bonding and placement solution. Uniqarta's technology is branded as Laser-Enabled Advanced Placement, or LEAP).

XDC installs the world's first 300mm elastomer stamp based microLED transfer tool

MicroLED display technology developer X Display Company (XDC) announced that it installed the world's first 300 mm elastomer stamp based mass MicroLED transfer equipment late in 2020. This tool was installed in the US and the company hopes to start shipping several similar tools for its customers later in 2021.

X-Display Corp 300 mm microLED transfer equipment photo

XDC spun out of X-celeprint in 2019 and retained the equipment organization from that transaction. XDC has over 15 years of experience with mass transfer micro printing technologies, and is offering a range of tools for microLED transfer, suitable for R&D work and industrial-scale production.