Rohinni designed a parallel-design for its miniLED bondhead equipment to achieve 14X placement speed boost

Micro-LED and mini-LED developer Rohinni announced that the company has developed a new design for its miniLED composite bondhead, which now allows multiple bondheads to run in parallel. Rohinni says it has been able to accelerate its miniLED deposition speed 14X compared to 'competing technologies'.

Rohinni miniLED bondhead deposition photo

With the new system, Rohinni demonstrated >99.999% placement yield and scalability at speeds< greater than 100 die per second. said that it developed a new placement technology for mini-LED that doubles the placement speed compared to its previous technology.

eLux installs a new automated fluidic assembly R&D tool, unveils a new microLED display prototype

USA-based eLux was established in 2016 as a spin-off from Sharp Labs of America, to commercialize a unique MicroLED production technology. A year ago we discussed the company's technology and business with its CEO, Jong-Jan Lee.

eLux automated fulidic assembly tool, 2021

Today eLux announced that it has installed an automated fluidic assembly tool at its prototype fab in Taiwan. The new tool features fully automatic cassette-to-cassette fluidic assembly of ten display panels, each up to 15-inch in size. The tool has provisions for capture and recycle of microLEDs and assembly fluids to minimize operating costs, and its capacity can be expanded by adding two additional modules.

STRATACACHE CEO details the challenges and goals of the company's upcoming US-based microLED display production fab

Global digital signage solution provider STRATACACHE is constructing the first US-based complete display production facility in Eugene, Oregon. The future MicroLED E4 fab is planned to commence production in 2022, and the fab will be a complete microLED production line, from epiwafer (on 300 mm silicon wafers), through transfer process and to final module assembly.

STRATACACHE Eugene E4 MicroLED fab photo

This project is extremely interesting, and we set out to discuss it with STRATACACHE's founder and CEO, Chris Riegel. At STRATACACHE, Chris leads strategic direction, technology development and engineering operations, and the MicroLED fab project seems to be personally spearheaded by him.

Kulicke & Soffa acquires microLED placement technology developer Uniqarta

Singapore-based electronics assembly solutions provider Kulicke & Soffa announced that it has acquired Uniqarta, a US-based developer of MicroLED placement technology.

Uniqarta LEAP microLED placement technology illustration

Uniqarta developed a unique LED die transfer technology that uses ultra-fast lasers to enable contactless LED de-bonding and placement solution. Uniqarta's technology is branded as Laser-Enabled Advanced Placement, or LEAP).

XDC installs the world's first 300mm elastomer stamp based microLED transfer tool

MicroLED display technology developer X Display Company (XDC) announced that it installed the world's first 300 mm elastomer stamp based mass MicroLED transfer equipment late in 2020. This tool was installed in the US and the company hopes to start shipping several similar tools for its customers later in 2021.

X-Display Corp 300 mm microLED transfer equipment photo

XDC spun out of X-celeprint in 2019 and retained the equipment organization from that transaction. XDC has over 15 years of experience with mass transfer micro printing technologies, and is offering a range of tools for microLED transfer, suitable for R&D work and industrial-scale production.

Vuereal announces a partnership with ASMPT to integrate the company's transfer and bonding solutions

Canada-based microLED technology developer VueReal announced a partnership with ASM Pacific Technologies (ASMPT) to integrate VueReal's cartridge microLED mass transfer solution into ASMPT's mass transfer bonding solution for microLED display applications.

Vuereal says that this new partnership will allow its customers to achieve 99.99+% transfer yields on LED's smaller than 10 micrometers.

Rohinni doubles the speed of its mini LED placement process

Micro-LED and mini-LED developer Rohinni said that it developed a new placement technology for mini-LED that doubles the placement speed compared to its previous technology.

Rohinni - Luumii flexible keyboard LEDs photo

Rohinni developed a new bondhead which achieves a 100 Hz placement operation which effectively cuts in half the cost of placing mini LEDs. The technology will be deployed in the first part of 2021.

VerLASE reports it has achieved substantial progress in its micro-LED display transfer technology

US-based parallel microLED assembly technology developer VerLASE Technologies reports today that it has achieved substantial progress in its mass transfer process for micro-LED displays.

VerLASE microLED transfer process scheme

VerLASE now plans to develop the process flow for an assortment of dies sizes from 200 X 200 um (mini-LEDs) down to 10 X 10 um and eventually also 5x5 um. VerLASE plans to demonstrate the transfer of both flip-chip, and vertical thin film LED architectures.

InZiv - Transforming MicroLED display inspectionInZiv - Transforming MicroLED display inspection