MicroLED Transfer (Pick and place)

Kookmin University researchers develop an integrated microLED display fluidic assembly platform

Researchers from Korea's Kookmin University developed an integrated assembly technology, that can enable microLED devices to be precisely assembled at desired positions and in desired orientations.

The new technology integrates several manufacturing processes, including mass fluid assembly, chip orientation control, defective-pixel repair and mass transfer on a single alignment platform. The researchers term the technology "Dielectrophoretic Injection-Suction Printing", or DEP-ISP.

Read the full story Posted: Aug 28,2026

MicroLED-Info releases a new version of its MicroLED Transfer Process Market Report

We are happy to announce a new edition of our MicroLED Transfer Process Market Report, with all the latest information, new technologies and companies, and more. MicroLEDs are advancing quickly and the transfer process remains one of the key challenges, with several technologies and processes competing for different market segments.

Reading this report, you'll learn all about:

  • All known microLED transfer processes
  • The current industry and market status
  • Advantages and disadvantages of transfer technologies
  • Future technologies and roadmaps

The report package also provides:

  • An introduction to microLED production processes
  • Over 25 presentations, brochures and technical papers
  • MicroLED chip-level market estimates and forecasts
  • Free updates for a year

This microLED display transfer process report provides a comprehensive look into current and future LED transfer technologies processes used for the production of microLED displays. The report covers everything you need to know about the current status of the industry.

Read the full story Posted: Aug 26,2026

Pixel-Flo raises $7 million in its seed round to bring its microLED transfer process to market

Continuous fluidic microLED transfer process develop Pixel-Flo announced that it has raised £5.25 million ($7 million USD) in its seed round, led by Northern Gritstone with additional investment from SCVC, the Parkwalk Northern Universities Venture Fund, and HTGF.

Pixel Flo founding team

The company say that these new funds will support its transition from laboratory development towards industrial scale-up, expanding its team and relocating to new lab and office space.

Read the full story Posted: Jul 09,2026

PlayNitride reports its financial results for Q1 2026, cancels $31 million expansion plan, opens Singapore subsidiary

Taiwan-based MicroLED developer PlayNitride announced its financial results for Q1 2026, with 135.8 million NTD ($4.3 million USD) in revenues, down from 300 million NTD last year. The company's net loss reached 251.8 million NTD (almost $8 million), up from a loss of 51.5 million NTD last year.

A few days ago, PlayNitride also announced that its China-based subsidiary PlayNitride Kunshan has cancelled its plans to buy new microLED mass transfer equipment from Suzhou-based Yuzhu Semiconductor. The original deal (signed in February 2026) was worth $31.3 million. Yuzhu Semi will refund all payments made by PlayNitride and will not claim and compensation or restitution.

Read the full story Posted: May 04,2026

MicroLED-Info releases a new version of its MicroLED Transfer Process Market Report

We are happy to announce a new edition of our MicroLED Transfer Process Market Report, with all the latest information, new technologies and companies, and more. MicroLEDs are advancing quickly and the transfer process remains one of the key challenges, with several technologies and processes competing for different market segments.

Reading this report, you'll learn all about:

  • All known microLED transfer processes
  • The current industry and market status
  • Advantages and disadvantages of transfer technologies
  • Future technologies and roadmaps

The report package also provides:

  • An introduction to microLED production processes
  • Over 25 presentations, brochures and technical papers
  • MicroLED chip-level market estimates and forecasts
  • Free updates for a year

This microLED display transfer process report provides a comprehensive look into current and future LED transfer technologies processes used for the production of microLED displays. The report covers everything you need to know about the current status of the industry.

Read the full story Posted: Apr 13,2026

A spotlight on ETRI: a MicroLED Industry Association member

We’re pleased to feature ETRI, Korea's national research institute conducting advanced R&D across ICT, semiconductors, AI, and digital technologies, in our latest MicroLED Industry Association spotlight series.

ETRI institute, South Korea

Among its diverse research areas, ETRI is advancing microLED displays through SITRAB (Simultaneous Transfer and Bonding), a laser-assisted technology enabling high-throughput, precise, and scalable MicroLED integration.

We spoke with Dr. Kwang-Seong Choi, Assistant Vice President and principal researcher at ETRI.

Read the full story Posted: Apr 03,2026

Researchers develop a new microLED transfer process based on a dynamically programmable heater transfer head

Researchers from the Hong Kong University of Science and Technology (Guangzhou), led by Prof. Yunda Wang, have developed a novel microLED transfer process, based on a dynamically programmable transfer head that uses localized heating to control a polymer's stickiness.

The researchers say that this new tool's ability to selectively handle a diverse range of geometries addresses a critical bottleneck in building complex microsystems. The researchers proved their system could selectively sort and transfer functioning 45-by-25-micrometer microLEDs to form custom layouts without degrading their performance.

Read the full story Posted: Mar 26,2026

ETRI demonstrates 4,000 PPI microLED display, using its SITRAB solder bonding technology

Korea's ETRI demonstrated a 4,000 PPI 720x540 monochrome microLED display, produced using its proprietary SITRAB bonding technology. The researchers at ETRI says that this demonstration showcases a scalable alternative to hybrid bonding for ultra-high-resolution integration.

1 µm Solder Bumps at 4 µm Pitch, enabling a 4000 PPI microLEDF

The device was fabricated by bonding microLED chips to a silicon backplane using a Cu pillar / Sn solder cap structure with approximately 1 µm bump diameter and 4 µm bump pitch. 

Read the full story Posted: Feb 21,2026

Researchers develop a graphene-based microLED self-aligned laser transfer process

Researchers from Huazhong University of Science and Technology have reported a self-aligned laser transfer (SALT) based on directional photothermal regulation strategies that enables high-precision, programmable transfer of microchips or microLEDs without the need of precise laser-to-die alignment.

The researchers demonstrated multiple transfer printings of RGB MicroLED chips from different donor wafers highlight SALT’s self-aligned and batch-selective capabilities, which are crucial for efficient full-color MicroLED display assembly.

Read the full story Posted: Jan 28,2026

Daktronics acquires XDC's IP and equipment, aiming to integrate its microLED technologies in its product

US-based signage developer Daktronics announced that it has acquired IP, equipment and technical expertise from X Display Company (XDC). It is not clear whether XDC remains an active company, or whether it has shut down after the acquisition. The company did not disclose the financial implications of this acquisition.

XDC and Lumileds 140 PPI microIC microLED display prototype photo

Daktronics says that the acquisition will enable it to integrate these technologies into its own products. The IP assets include XDC's mass transfer technologies and microLED fabrication, which Daktronics aims to use in large-format video walls and medium-sized commercial displays.

Read the full story Posted: Dec 24,2025