XTPL, a leader in ultra-precise additive manufacturing solutions for next-generation microelectronics, has announced that it has officially joined NextFlex, America’s Hybrid Electronics Manufacturing Innovation Institute. As part of this collaboration, XTPL has installed one of its cutting-edge development systems at the NextFlex Technology Hub in San Jose, enabling members and non-members to explore, test, and prototype breakthrough additive manufacturing applications.
From left to right: Art Wall, Urs Berger, Filip Granek, Daniel Gamota
XTPL’s proprietary ultra-precise deposition technology enables printing of conductive features down to sub-micron resolution, unlocking opportunities for advanced semiconductor packaging, flexible electronics, display technologies, sensor development, and high-performance interconnects. By making this system available within the NextFlex manufacturing community, XTPL aims to accelerate innovation and support R&D programs focused on miniaturization, integration, and manufacturability.