JBD upgrades its microLED process to utilize 12-inch reconstructed LED wafers
China-based microLED microdisplay developer JBD announced that it has completed a major upgrade of its microLED microdisplay mass-production architecture, and has shifted from 4-inch manufacturing to a 12-inch reconstructed wafer platform. This is a sort of medium step before full 12-inch LED epiwafer deposition.

JBD says that the current wafer mismatch between the 4-inch LED wafer and the 12-inch silicon backplane wafer has become a key factor limiting cost efficiency and substrate utilization. JBD has integrated its "die-to-carrier-to-wafer" bonding scheme into its volume production architecture. Under this process, small-format epitaxial wafers are diced into individual dies, followed by pre-bond inspection and sorting to identify and remove defective chips at an early stage. Qualified dies are then reconstituted onto a temporary 12-inch carrier substrate with high placement accuracy and uniformity, creating a reconstructed epitaxial wafer for subsequent wafer-level bonding with a matching 12-inch silicon backplane.





