Researchers develop a novel high-throughput and non-destructive microLED EL measurement technology
Researchers from China's Tianjin University has developed a high throughput and non-destructive EL measurement method for microLED chips. The researchers say that this new method is not only non-destructive, it also extends the lifetime of the probe significantly (to over a million contact cycles) compared to other methods.
The new method is based on a flexible three-dimensional probe array that is capable of adapting to the microscopic contours of micro-LED wafers. The total pressure applied on the LEDs is only 0.9 megapascals (said to be comparable to a gentle breath). The probe head has 32 × 32 pairs of probes that can simultaneously measure 1,024 microscale LEDs using a passive-matrix driving approach in half a second.