3D Nanowire MicroLED developer Aledia announced the commercial availability of FlexiNova, its patented high-voltage microLED platform designed to unlock scalable, energy-efficient Direct-View microLED displays for global markets.

15x30 µm² 6V FlexiNOVA microLEDs assembled on a 400 µm pitch backplane 

The company says it is the first in the world to successfully manufacture 3D Nanowire based microLEDs operating at 6V, with an ultra-compact 15 µm × 30 µm single body chip size, manufactured on 200 mm silicon wafers. The company, together with its partner CEA-Leti, is continuing to develop the technology and is developing a full portfolio of 6V and 9V operation with a constant efficiency for chip sizes down to 3.5 µm.

Napster has unveiled a new Napster Station product, an AI Kiosk, powered by a transparent microLED display, produced by AUO. It's not clear whether this is just a concept, or whether Napster actually aims to commercialize this soon.

The kiosk was developed by China-based faytech Tech, an interactive display solution developer. The main idea is that this kiosk can transform concierge service and commerce, with use cases in retail, hospitality, transportation, healthcare and more. Users can engage with a library of domain-specific AI Companions through real-time video interactions, moving beyond traditional text chat and democratizing access to expertise for users worldwide.

Lam Research signed a multi-year research agreement with CEA-Leti, to advanced the fabrication of next-generation specialty semiconductor technologies. One of the focus areas is microLED displays.

CEA‑Leti said its role will center on rapid materials analysis and device characterization to support faster process optimization.

Wearable device maker Amazfit is developing its 2nd Gen T-Rex Ultra smartwatch, and according to a leaked image, it will be using a microLED display, offering over 3,000 nits brightness. The display will be 1.5-inch in size. 

If this is true, the display will likely be produced by AUO (which is the only commercial wearable microLED display producer), and this will be excellent news for the microLED, the 2nd wearable product following the Garmin Fenix 8 Pro MicroLED. 

MicroLED Connect + AR/VR Connect 2026 returns for its 3rd year on 16–17 September 2026 at the High Tech Campus in Eindhoven, The Netherlands – the “smartest square kilometer in Europe” and a rapidly growing deep-tech hub. After a sold-out exhibition and packed auditoriums in 2025, the 2026 edition will be even bigger, bringing together the global microLED and immersive-display community under one roof.

MicroLED Connect + AR/VR Connect is a co-located conference and exhibition dedicated to next‑generation displays, spanning: microLEDs and miniLEDs, quantum dots and color conversion, AR/VR/MR/XR light engines, microdisplays, optics and waveguides, automotive and wearables, production processes, equipment, and market analysis. The event is powered by TechBlick, the MicroLED Industry Association, and MicroLED‑Info, and is designed as a high‑impact forum where innovators, suppliers, manufacturers, investors, and end users can meet, learn, and do business.

Researchers from Huazhong University of Science and Technology have reported a self-aligned laser transfer (SALT) based on directional photothermal regulation strategies that enables high-precision, programmable transfer of microchips or microLEDs without the need of precise laser-to-die alignment.

The researchers demonstrated multiple transfer printings of RGB MicroLED chips from different donor wafers highlight SALT’s self-aligned and batch-selective capabilities, which are crucial for efficient full-color MicroLED display assembly.

Researchers from Korea's KAIST, Inha University, QSI and Raontech have jointly developed a high-density high-efficiency red microLED microdisplay, achieving a pixel density of 1700 PPI.

The researchers used Aluminum Indium Phosphide/Gallium Indium Phosphide (AlInP/GaInP) quantum-well microLEDs, and applied a monolithic 3D integration process to stack the microLED array directly on top of the backplane.

The MicroLED Industry Association (MIA) welcomes its newest member companies - Raysolve Optoelectronics and ETRI. The MIA aims to accelerate the adoption of microLED display technologies, bringing together companies, researchers and organizations active in the MicroLED industry and providing an ideal forum for solving common technology issues, fostering cooperation and sharing relevant information, resources and tools.

Raysolve Optoelectronics (Suzhou) is committed to developing and manufacturing high-performance full-color Micro-LED micro-displays, targeting emerging display technologies, particularly for AR glasses. The core team stemmed from the Hong Kong University of Science and Technology (HKUST) with decades of experience in the design and manufacturing of cutting-edge microchips. Raysolve’s proprietary QDs-based full-color technology enables full-color display on a single chip, while also setting a new world record for both its tiny size and high pixel density, achieving a revolutionary breakthrough.

"Raysolve has joined the MicroLED Industry Association to engage with the global Micro-LED ecosystem and collaborate with industry partners on Micro-LED technologies for emerging applications.”

IC designer Sapien Semiconductors announced that it has signed a strategic agreement with SEMFIVE, a provider of customer AI ASIC designs, to jointly advance the design and technical evaluation of CMOS microLED backplane technology.

The partnership covers both technology and business aspects, including design verification and simulation to enhance technical maturity, technical guidance on microLED display driver IC (DDI) implementation, and joint strategies for global market expansion.

Pyramidical GaN microLED developer Polar Light Technologies announced that it has produced a series of nano-scale InGaN LEDs, measuring 500 nanometers and smaller. The company says these are the smallest LEDs ever demonstrated.

The microLED devices have been produced using the company' monolithic bottom-up mask-based process, that has been now demonstrated to scale to significantly smaller dimensions without compromising performance or efficiency.