Micro-LED Production

China-based microLED microdisplay developer JBD announced that it has completed a major upgrade of its microLED microdisplay mass-production architecture, and has shifted from 4-inch manufacturing to a 12-inch reconstructed wafer platform. This is a sort of medium step before full 12-inch LED epiwafer deposition.

JBD says that the current wafer mismatch between the 4-inch LED wafer and the 12-inch silicon backplane wafer has become a key factor limiting cost efficiency and substrate utilization. JBD has integrated its "die-to-carrier-to-wafer" bonding scheme into its volume production architecture. Under this process, small-format epitaxial wafers are diced into individual dies, followed by pre-bond inspection and sorting to identify and remove defective chips at an early stage. Qualified dies are then reconstituted onto a temporary 12-inch carrier substrate with high placement accuracy and uniformity, creating a reconstructed epitaxial wafer for subsequent wafer-level bonding with a matching 12-inch silicon backplane.

China-based Innovision, developer of microLED microdisplays based on the company's vertically-stacked pixel (VSP) technology, announced a new 0.06" microLED microdisplay, the world's smallest microdisplay in production.

The Xinmou (also known as Chimo) M06 microdisplay offers a resolution of 540x280 (2.5 micron pixel pitch, 10,000 PPI) and ultra-low power consumption. 

STRATACACHE announced that it is engaging customers to provide domestically produced GaN-on-Silicon microLED epiwafers, aimed at both display and photonics applications. The move is part of the company’s broader strategy to scale North American microLED production at the companies Eugene Photonics Foundry and reduce dependence on Asian supply chains.

According to CEO Chris Riegel, the Eugene, Oregon fab is now accepting orders for Q3-Q4 200mm wafer production and is actively engaging with foundry customers in the photonics and display sectors. Riegel notes the growing demand for uLED-based photonic interconnects and highlights that “besides our Eugene Photonics Foundry, there is no scale domestic (U.S.) Gan-on-Silicon microLED manufacturing.”

3D Nanowire MicroLED developer Aledia announced the commercial availability of FlexiNova, its patented high-voltage microLED platform designed to unlock scalable, energy-efficient Direct-View microLED displays for global markets.

15x30 µm² 6V FlexiNOVA microLEDs assembled on a 400 µm pitch backplane 

The company says it is the first in the world to successfully manufacture 3D Nanowire based microLEDs operating at 6V, with an ultra-compact 15 µm × 30 µm single body chip size, manufactured on 200 mm silicon wafers. The company, together with its partner CEA-Leti, is continuing to develop the technology and is developing a full portfolio of 6V and 9V operation with a constant efficiency for chip sizes down to 3.5 µm.

Pyramidical GaN microLED developer Polar Light Technologies announced that it has produced a series of nano-scale InGaN LEDs, measuring 500 nanometers and smaller. The company says these are the smallest LEDs ever demonstrated.

The microLED devices have been produced using the company' monolithic bottom-up mask-based process, that has been now demonstrated to scale to significantly smaller dimensions without compromising performance or efficiency.

ALLOS Semiconductors announced a strategic partnership with Ennostar Corporation, to bring bring 200 mm GaN-on-Si microLED epiwafers into volume production. 

This partnership will enable ALLOS to offer its customers GaN-on-Si epiwafers at mass volume. This basically means that Ennostar has become ALLOS manufacturing partner, while ALLOS operates in a "fabless" model. In addition to manufacturing, Ennostar will also contribute its advanced LED-related technologies to further enhance the product performance.

China-based San’an Optoelectronics announced that it is progressing with its microLED products for AR applications, and is moving from the technology verification state, to the small-batch verification stage. 

San'an further says that it is working with both domestic and global device makers to optimize its microLED products.

China-based Star Key Semiconductor has officially inaugurated its microLED production line in Wuhan. This line is based on 8-inch GaN-on-Silicon microLED wafers, and will produce microLED microdisplays. The yearly capacity is around 12,000 wafers.

Star Key started producing this new fab in October 2024, and managed to complete the fab construction and all equipment placement in eight months. The company produces the microLED wafers, and processes these to create AR microdisplays. The company's first products will be monochrome microLED displays, but it is also developing color microLED displays.

LEKIN Semiconductor announced plans to build a new production line in Suzhou, to produce automotive optoelectronic modules and displays, in a 5.2 billion yuan investment ($735 million USD). 

The new fab, when complete, will produce vertically-integrated products, from LED epiwafers to display modules, and will have an annual capacity to "supply over 5 million cars". The company said that the second phase of this fab, will focus on mini-LED and micro-LED displays technologies. Over the next 3 years, LEKIN also intends to increase its R&D investment.

Chinese display maker HKC announced that its new direct-view LED fab in Mianyang is starting operation. The company says that this is a significant milestone for the company and its long-term strategy in the large-area display industry sector.

It is our understanding that currently the new fab will produce LED direct view displays that utilize miniLEDs, but in the future it will also produce microLEDs. In fact, HKC announced that "in the face of the rapid growth of the global MicroLED technology market" it will expand the microLED capacity in 2026. In the long-term its main application targets for its direct-view LED displays are commercial screens, home theaters, and automotive displays.