Micro-LED Production

Star Key Semiconductors raises $150 million to ramp up its microLED production

China-based microLED microdisplay developer Star Key Semiconductor has completed its latest funding round, raising over 1 billion RMB - or around $150 million USD. The round was led by CATL’s Puquan Capital, with participation from Meituan Longzhu, Guotai Haitong, Youshan Capital, CDH Hong Kong, and two (Chongqing and Jiangsu) state-owned investment firms.

In December 2025, Star Key inaugurated its microLED production line in Wuhan. This line is based on 8-inch GaN-on-Silicon microLED wafers, and will produce microLED microdisplays. The yearly capacity is around 12,000 wafers.

Read the full story Posted: Sep 08,2026

Polar Light Technologies produces its first microLED array at its new VTT Pilot Line

Polar Light Technologies announced that it has produced its first MicroLEDs via its Pilot Line at VTT Technical Research Centre Finland. The company says that its process flow transfer from the laboratory to the VTT pilot line is ahead of schedule - "demonstrating the advantages of pyramidal MicroLEDs and selected area growth".

The next step for PLT is to focus on homogeneity, yield and the integration of the MicroLEDs to a CMOS backplane. The company's goal is to produce a complete microLED microdisplay in the pilot line, and towards that it will develop bonding and integration of the MicroLEDs frontplane onto the CMOS backplane.

Read the full story Posted: Jul 31,2026

JBD starts to construct the second phase of its Hefei microLED microdisplay fab

China-based MicroLED microdisplay developer JBD is starting to construct the 2nd phase of its Hefei MicroLED production fab. The company held a ceremony to break ground on its new project, saying that it actually started 62 days ahead of its original schedule, as the local government of Hefei processed its applications faster than expected.

JBD Hefei microLED production hub, phase 2

This is the 2nd phase of JBD's $92 million microLED fab, that started production in 2023. JBD says that the 2nd phase investment will total $100 million. In 2025, the company said that its output volume increased over 160% from 2024, and the new line will help it increase its capacity, while also enabling more R&D projects.

Read the full story Posted: Jul 20,2026

San'an delays its plans to produce miniLED and microLED chips in Hubei

In 2019 San'an Optoelectronics announced that it is planning to build a $1.78 billion miniLED and microLED production site in Hubei. The plans, originally, was to start production in March 2021. The construction was delayed, though, due to the Covid-19 pandemic, and a few years later San'an delayed its plans and aimed to start producing LEDs in Hubei in 2026.

Today San'an announced that it is delaying the production of miniLED and microLED at the Hubei plant - to June 2028. San'an said that the decision to delay was due to macroeconomic volatility, sluggish markets and slower-than-expected progress in critical microLED processes. So far the company invested 51% of the $1.78 billion, and as it "aims to avoid premature capacity buildup amid market uncertainty".

Read the full story Posted: Jun 30,2026

Innovision officially launches its dual-color Chimo P13 microLED microdisplay, begins low-volume commercial production

Last month we reported that Innovision showcased its latest microLED displays at SID Display Week 2026, and unveiled its Chimo P13 dual-color microdisplay. 

Innovision dual-color microLED microdisplay images

The company now officially launched this new 0.13" 640x240 (4 um sub-pixel pitch) display. The Chimo P13 is a single microLED panel that combines green and red microLED chips, based on the company's WLVSP (Wafer-Level Vertical Stacked Pixel) design.

Read the full story Posted: Jun 23,2026

BOE HC SemiTek expands beyond microLED epiwafers to microdisplays and optical I/O solutions

China-based BOE HC Semitek says that it is expanding its microLED business, from focusing on microLED epiwafer production to also developing microdisplays and optical I/O solutions.

The company says it has developed a monochrome microLED microdisplay, and is now working to improve the performance and the production yields. It is already shipping samples to potential customers, and is slated to begin low-volume commercial production soon. 

Read the full story Posted: Jun 16,2026

Westlake Smokey Mountain Technology starts operating its 8-inch GaN-On-Silicon microLED microdisplay fab

Westlake Smokey Mountain Technology (Yanshan Technology) has officially started operating its 8-inch GaN-on-Silicon microLED microdisplay production line, in Deqing, Zhejing, China. The company says this is the world's first 8-inch silicon microLED fab in operation.

Westlake Smokey Mountain Technology logo

The WSMT fab i s a full process line, that includes all steps from microLED epiwafer deposition to full display packaging. It currently operates on a small scale, but when fully operational it will have the annual capacity to produce 3 million microLED devices.

Read the full story Posted: May 29,2026

Polar Light Technologies to setup a pilot line at VTT

Polar Light Technologies announced that it has signed its first Pilot Line agreement with VTT Technical Research Centre of Finland. 

Polar Light has already begun its process flow transfer from the laboratory to VTT's Pilot Line. The Pilot Line will cover the full manufacturing flow required for Polar Light's first microLED product, which will help the company to accelerate the validation, scaling and product readiness.

Read the full story Posted: May 28,2026

JBD upgrades its microLED process to utilize 12-inch reconstructed LED wafers

China-based microLED microdisplay developer JBD announced that it has completed a major upgrade of its microLED microdisplay mass-production architecture, and has shifted from 4-inch manufacturing to a 12-inch reconstructed wafer platform. This is a sort of medium step before full 12-inch LED epiwafer deposition.

JBD says that the current wafer mismatch between the 4-inch LED wafer and the 12-inch silicon backplane wafer has become a key factor limiting cost efficiency and substrate utilization. JBD has integrated its "die-to-carrier-to-wafer" bonding scheme into its volume production architecture. Under this process, small-format epitaxial wafers are diced into individual dies, followed by pre-bond inspection and sorting to identify and remove defective chips at an early stage. Qualified dies are then reconstituted onto a temporary 12-inch carrier substrate with high placement accuracy and uniformity, creating a reconstructed epitaxial wafer for subsequent wafer-level bonding with a matching 12-inch silicon backplane.

Read the full story Posted: May 15,2026