3D-Micromac announced a new microLED mass transfer tool, called microCETI. The company says its new technology can be used to transfer over 130 million microLEDs per hour.

MicroCETI is based on a laser-induced forward transfer (LIFT) process that can support almost any microLED material and shape. The tool also includes optional modules - a laser lift-off (LLO) module, and a single LED die repair module.

The MicroCETI system supports microLEDs, miniLEDs and also regular LED transfer, with donor LED wafers ranging from 2-inch to 6-inch (200 mm) and a target substrate size of 350x350 mm (MicroCETI equipment can be customized for other substrate sizes).

3D-Micromac microCETI 3D photo

The new system offers very high precision in all axis systems, fully-automated alignment syste and features MicroMac's MicroMMI and inspection software. For more information, click here (or download the product brochure here).

3D-Micromac: LIFT process illustration

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