InZiv Ships MicroLED Characterization Equipment

Israel-based display characterization and inspection equipment maker InZiv has recently announced the shipment of a high-resolution pixel characterization tool to an undisclosed Tier-1 consumer electronics company.

InZiv high-resolution microLED pixel characterization tool closeup photo

InZiv’s tool offers MicroLED defect detection on the wafer and pixel level with unprecedented sub-micron resolutions. Measuring luminescence, spectral wavelengths and 3D structure at the highest resolutions, the equipment enables the identification and the source of defects, accelerating product time to market.

PlayNitride aims to raise a further $100 million for microLED display volume production in 2020

In July 2019 Taiwan-based microLED developer PlayNitride raised $50 million to start trial production of microLED displays. The company now says it seeks to raise over $100 million more as it will require large funds to initiate mass production.

PlayNitride high-brightness high-density passive-matrix wearable Micro-LED prototype (SID 2019)

PlayNitride is considering several production models - from constructing its own production lines, through a joint-venture with strategic partners to the licensing of its technology. The main goal of the company is to start production as soon as possible. The company hopes mass production can begin by the end of 2020.

AU Optronics sees Micro-LED displays entering the market in the next 1-2 years

AU Optronics president, Paul Peng, says that he expects Micro-LED displays to enter the market within 1-2 years. The first displays will be large-area signage and small-sized VR displays. Micro-LEDs for the automotive market will take longer to commercialize - around 5 years.

AUO 12.1'' LTPS micro-LED prototype (August 2019)

AUO recently demonstrated a 12.1" LTPS micro-LED display prototype that features a resolution of 1920x720 (169 PPI). AUO discloses that this display was produced using the company's self-developed transfer process that can move 50,000 - 60,000 LEDs per transfer (AUO did not detail the time it takes to perform a single transfer, though). AUO is now developing repair technology to take care of damaged LEDs.

PlayNitride raises $50 million, will start trial production of microLED chips by the end of August 2019

Digitimes reports that PlayNitride raised $50 million and is ready to start trial production of micro-LED chips by the end of August 2019. PlayNitride will increase its headcount by 100 employees.

PlayNitride told Digitimes that it achieved a yield rate of 99.9% in its LED transfer (pick-and-place) process. Using mass repair technologies, the company is certain it can achieve commercial viability of its process. The company's mass transfer speed is 10,000 chips per second. This means that for a Full-HD (1920x1080) display it will take just over 10 minutes to transfer the LED chips. A 4K display will take just over 40 minutes.

VerLASE Technologies announces new technologies for massively parallel assembly of microLED dies and films

VerLASE logoUS-based VerLASE Technologies announced that it is developing technologies for massively parallel assembly of microLED dies or films. The company has already files for multiple patents for its new technology.

VerLASE says that it is using practical methods and well-proven semiconductor and MEMs industry methods and existing tools. The company's technology will enable "deterministic, massively parallel transfers of microdie, with provisions that allow selective repair". The methods involve techniques used daily in Ink-Jet Printing but is not printing per se.

Coherent reports new orders for its Micro-LED laser R&D tools

Laser equipment maker Coherent says that its customer have expressed a "reasonable amount of interest " in its Micro-LED solutions. The company is taking orders for R&D tools, but it says that mass production of Micro-LED displays is "still years away".

Coherent offers several laser-based tools used to produce Micro-LED displays, including Laser Lift-Off equipment (LLO) used to separate micro-LEDs from the sapphire wafer and Laser Induced Forward Transfer (LIFT) used to move micro-LEDs from the donor to substrate.