LLO

We're happy to interview 3D Micromac, as part of our series of interviews with MicroLED Industry Association members. Germany-based 3D-Micromac is the industry leader in laser micromachining and roll-to-roll laser systems. The company offers laser equipment for µLED forward transfer, lift-off and repair process steps - ready for high volume production.

Hello, can you introduce your company and technology?

Frank Richter (Head of Sales at 3D Micromac): 3D-Micromac has established itself as a leader in laser micromachining and a pioneer of new production technologies for various industries for the last 20 years. This especially applies to the excimer and ultra-short pulse laser technology.

We have extensive experience applying innovative laser technology to new and emerging applications to support their volume-production requirements. For MicroLED production, ultra-high precision in combination with the highest reliability and stability is needed. These are core competencies of 3D-Micromac.

Our product portfolio includes several laser-based system solutions for various manufacturing steps in the MicroLED production process. All systems offer integrated process control and monitoring to assure stable and reliable operation, thus enabling high throughput and low yield losses. 

Germany-based 3D-Micromac is the industry leader in laser micromachining and roll-to-roll laser systems. The company develops and manufactures processes and laser systems delivering powerful, user-friendly and leading-edge processes with superior production efficiency. 3D-Micromac offers industrial laser solutions for the mass production of microLED displays.

We had the pleasure of talking to Frank Richter, Head of Sales and Product Management at 3D-Micromac. Frank explained 3D-Micromac's solutions and technologies for microLED production, and the company's views on the future of microLEDs.

Q: Can you detail 3D-Micromac's solutions for the MicroLED market?

Frank Richter, Head of Sales and Product Management: 3D-Micromac’s product portfolio includes several laser-based system solutions for various manufacturing steps in the MicroLED production process. All systems offer an integrated process control and monitoring to assure stable and reliable operation thus enabling high throughput and low yield losses.

3D-Micromac announced that a leading optical solutions provider has purchased several microMIRA laser lift-off (LLO) systems to use in the production of microLED devices. The systems will be installed in pilot lines and production lines at its state-of-the-art LED chip factory in Asia

3D-Micromac says that the microMIRA laser system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer's unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

This is an article by TechBlick, organizers of the upcoming MicroLED Displays virtual event. MicroLED-Info readers get a 100 Euro discount.

In this article, using select technology slides, we highlight several interesting advancements in MicroLED and/or QD displays. More specifically, we cover 3600PPI “Silicon” Displays | Gravure printed microbumps | Electrohydrodynamically printed QD color converters | Laser LLO and Transfer for MicroLEDs | QD vs Phosphors | Energy saving credentials of microLED

“Silicon” Displays with an incredible 3600ppi full color using microLED and QD technology?

Sharp (HIRANO Yasuakie et al) has developed this technology.

As shown in the slide below, first blue-only uLEDs are formed on a sapphire substrate. Here, one LED array contains 352 x 198 micro LED dies of 24 um x 8 um in size. In parallel, an LSI chip containing the driving circuitry is formed on a silicon wafer. Here, the cathode (N-type electrode) and anode (P-type electrode) are fabricated for each micro LED die to apply driving voltage independently to each die. The Au bump electrodes are fabricated in accordance with the pitch of the LED dies. The two substrates are flip-chip bonded using Au-Au bonding. Here one can already see the parallel to the silicon and optoelectronic industry (vs. the traditional thin film display industry!). Next, the sapphire layer is removed via laser lift off. Finally, Cd-free quantum dots (green and red) are deposited atop the microLED dies to enable R G color conversion. This way one achieves RGB colors.

This is a sponsored post by Coherent

Coherent is a leading global supplier of lasers and photonics technology. For the MicroLED industry, Coherent provides several solutions from a single laser source, optical systems up to an integrated system for the three vital processes in MicroLED fabrication – Laser Lift-Off (LLO), Laser-Induced Forward Transfer (LIFT), and Repair/Trimming.

Coherent recently published a new white paper that provides an update on how high-energy ultraviolet laser beams enable LLO and LIFT processes. The white paper shows the importance of a perfect combination of laser and optical design to a how these lasers ensure placement accuracy and mass transfer that will remain future-proof as microLED chip die size continues to shrink.

Germany-based laser micromachining and roll-to-roll laser system developer 3D Micromac announced that Marko Gerlach will become the company's CFO, effective immediately. The previous interim CFO, Frank Jäger, will remain with 3D-Micromac AG for a period of time to help ensure a smooth transition before leaving the company.

Marko Gerlach began his professional career in tax consulting and auditing. For approximately 10 years, he provided services to small- and medium-sized companies in the fields of annual audits, management consulting and all tax matters. Since 2009, Marko Gerlach has held various management positions within the Jenoptik Group.

The founder and General Manager of Bolite Optoelectronics, Dr. Bowen Cheng, was invited to present at the recent Touch Taiwan 2021 Conference in April. The title of his talk was “Laser Processing Applications for the Manufacturing of Mini and MicroLED Displays.” Since it was presented in Mandarin only, microled-info.com caught up with Dr. Cheng to learn more about this trending subject and the company he started.

Q: Dr. Cheng, can you please tell us a little about your background, prior to starting Bolite?

I was a research engineer at Xerox PARC and helped develop surface micromachined microspring interconnects in a project funded by the U.S. Army Research in collaboration with Oracle. I was also a vital member of the team that successfully demonstrated the world's shortest wavelength diode laser at the time, a 250 nm UV laser for military applications. With these experiences in both semiconductor laser processing and MEMS processing, I decided to start Bolite and build a team to develop state-of-the-art laser solutions for microprocessing applications.

Q: I must admit I’ve not heard of Bolite before. What differentiates you from other laser microprocessing companies?

3D-Micromac announced a new microLED mass transfer tool, called microCETI. The company says its new technology can be used to transfer over 130 million microLEDs per hour.

MicroCETI is based on a laser-induced forward transfer (LIFT) process that can support almost any microLED material and shape. The tool also includes optional modules - a laser lift-off (LLO) module, and a single LED die repair module.