ETRI demonstrates 4,000 PPI microLED display, using its SITRAB solder bonding technology
Korea's ETRI demonstrated a 4,000 PPI 720x540 monochrome microLED display, produced using its proprietary SITRAB bonding technology. The researchers at ETRI says that this demonstration showcases a scalable alternative to hybrid bonding for ultra-high-resolution integration.
1 µm Solder Bumps at 4 µm Pitch, enabling a 4000 PPI microLEDF
The device was fabricated by bonding microLED chips to a silicon backplane using a Cu pillar / Sn solder cap structure with approximately 1 µm bump diameter and 4 µm bump pitch.
