Rohinni designed a parallel-design for its miniLED bondhead equipment to achieve 14X placement speed boost
Micro-LED and mini-LED developer Rohinni announced that the company has developed a new design for its miniLED composite bondhead, which now allows multiple bondheads to run in parallel. Rohinni says it has been able to accelerate its miniLED deposition speed 14X compared to 'competing technologies'.
With the new system, Rohinni demonstrated >99.999% placement yield and scalability at speeds greater than 100 die per second. said that it developed a new placement technology for mini-LED that doubles the placement speed compared to its previous technology.