Micro-LED and mini-LED developer Rohinni announced that the company has developed a new design for its miniLED composite bondhead, which now allows multiple bondheads to run in parallel. Rohinni says it has been able to accelerate its miniLED deposition speed 14X compared to 'competing technologies'.
With the new system, Rohinni demonstrated >99.999% placement yield and scalability at speeds greater than 100 die per second.
Earlier this year Rohinni said that it developed a new placement technology for mini-LED that doubles the placement speed compared to its previous technology and achieves a 100 Hz placement operation.
Rohinni is focusing on miniLEDs and relatively-large (34-50 um) microLED chips.
Posted: May 01,2021 by Ron Mertens