Production equipment - Page 2

Researchers from Korea's ETRI institute developed a new chip packaging material, that is said to reduce the power consumption of the process by 95%, and reduce the number of required stages from 8 to 3. This could make semiconductors production much more efficient and lower in cost. 

The technology is applicable to all high-end semiconductor production - including microLED production. Indeed the team reports that they have reached out to several microLED developers to evaluate the technology, and the initial testing has been very positive. The material could be commercialized in three years.

Finland based Comptek Solutions announced that it has successfully closed its its Series A funding round, raising a total of 8 million Euro, from the Horizon Europe EIC Fund, LIFTT (Italian venture firm) and an undisclosed key strategic partner.

The funds will be used to accelerate Comptek's technology implementation, and scale up its growth. Comptek was founded in 2017, and develops passivation technology for Optoelectronics and power applications.

Kulicke and Soffa (K&S) announced that it is extending its long-term collaboration with surface mounting technology expert TSMT, to further enhance K&S' mini-LED and micro-LED placement solutions and get it ready for mass-volume adoption.

K&S offers its LUMINEX laser-based transfer solution, and the company now updates that it is working, together with TSMT, to enhance the yield from 99.99% to 99.999%. 

Veeco reports its financial results for Q2 2023, with revenues of $162 million (towards the high-end of its guidance) with a net income of $24 million.

Veeco says it remains committed to its microLED opportunities, as its long-term outlook on the microLED industry is positive. In the short term, however, it has sold some GaN-on-Silicon tools, but it has seen market pushing out about a year, and does not expect any significant orders until 2025.

We're happy to interview 3D Micromac, as part of our series of interviews with MicroLED Industry Association members. Germany-based 3D-Micromac is the industry leader in laser micromachining and roll-to-roll laser systems. The company offers laser equipment for µLED forward transfer, lift-off and repair process steps - ready for high volume production.

Hello, can you introduce your company and technology?

Frank Richter (Head of Sales at 3D Micromac): 3D-Micromac has established itself as a leader in laser micromachining and a pioneer of new production technologies for various industries for the last 20 years. This especially applies to the excimer and ultra-short pulse laser technology.

We have extensive experience applying innovative laser technology to new and emerging applications to support their volume-production requirements. For MicroLED production, ultra-high precision in combination with the highest reliability and stability is needed. These are core competencies of 3D-Micromac.

Our product portfolio includes several laser-based system solutions for various manufacturing steps in the MicroLED production process. All systems offer integrated process control and monitoring to assure stable and reliable operation, thus enabling high throughput and low yield losses. 

Korea-based Top Engineering developed and launched a new microLED chip inspection tool, offering non-contact EL inspection.

The equipment can analyze LED chips directly on the epiwafer, and inspect thousands of microLED chips at the same time. The tool can use non-contact EL inspection on vertical microLED chips.

This is a sponsored post by XTPL

Say hello to the future of electronics with Ultra-Precise Deposition (UPD) technology! This cutting-edge method allows us to create intricate, high-resolution electronic devices with greater flexibility and precision than ever before. UPD is set to revolutionize the world of additive manufacturing, offering a much-needed solution for printing conductive and insulating structures on complex substrates.

So, what is UPD, and why is it such a game-changer? It's a unique way of printing conductive and insulating materials onto various surfaces, both rigid and flexible. It helps fix defects in OLED displays and connects the tiny components in microLED arrays. The best part? It's versatile and adaptable to a wide range of applications, from flexible electronics to solar cells and MEMS devices.

Aixtron announced today that ams OSRAM has qualified Aixtron's AIX G5+ C and G10-AsP MOCVD systems on 200mm wafers for a Micro LED production.

ams Osram will be using Aixtron's systmes at its upcoming 200 mm mass production line in Malaysia, which is expected to begin production in 2024.

ClassOne Technology, a developer of advanced electroplating and wet processing tools for microelectronics manufacturing, says that it has received a follow-on order for its Solstice GoldPro gold electroplating system from a leading microLED maker with global manufacturing sites.

The new system will be used at the customer’s new manufacturing site in Asia for high-volume production of next-generation microLEDs deployed in a range of end applications.

We're happy to interview ClassOne Technology, as part of our series of interviews with MicroLED Industry Association members. ClassOne develops and sells high-performance electroplating and wet processing systems for the manufacture of advanced microelectronics, for both R&D and high-volume fab environments. For the microLED industry, ClassOne offers its Solstice single wafer electroplating and wet process platform, in addition to its reactor technology for the industry.

Q: Can you introduce your company and technology?

Joe Gaustad, Product Manager, ClassOne Technology: At ClassOne, our mission is to deliver the world’s highest performing and most elegantly designed electroplating and wet processing systems for the manufacture of advanced microelectronics. Engineered for maximum efficiency and flexibility on the manufacturing floor, our systems offer a comprehensive range of electroplating and wet process solutions validated, tested, fab proven, and designed for top performance in both high-volume and R&D fab environments.