Avicena, a developer of microLED-based chip-to-chip interconnects, discussed its solution at OCP Summit 2023. Avicena's LightBundle interconnect architecture is based on arrays of innovative GaN microLEDs that are integrated directly onto high performance CMOS ICs. Each microLED array is connected via a multi-core fiber cable to a matching array of CMOS-compatible PDs.
Avicena recently unveiled the world's first 1Tbps microLED-based Transceiver IC in 16nm finFET CMOS. The company says that its microLED-based LightBundle interconnects offers much lower power and latency, higher bandwidth and lower cost compared to current solutions based on VCSELs or Silicon Photonics.
In April 2022, Avicena raised $25 million from Samsung Catalyst Fund, Micron Ventures, and others. Later in 2022 the company acquired Nanosys' GaN microLED fab and engineering team. Avicena uses the fab and team to develop and produce high-speed GaN microLEDs optimized for its application.
The GaN microLED fab was previously owned by glō (before it was acquired by Nanosys), which invested over $200 million in the facilities, which include epitaxy, wafer processing, and lift-off and transfer tools to post-process silicon ICs with optical interfaces.