MicroLED Industry Association

The MicroLED Industry Association is introducing a new tiered membership pricing structure that reflects its commitment to fostering innovation across the entire microLED ecosystem. This updated approach is designed to support organizations of all sizes, from established industry leaders to promising startups and cutting-edge research institutions.

The new membership Pricing Tiers, by yearly revenues:

• Large companies (over $100 million): $3,000 per year
• Medium level enterprises ($5-100 million): $1,500 per year
• Early stage and small companies (up to $5 million): $800 per year
• Research groups and Universities: $500 per year

This tiered structure ensures that membership remains accessible to a diverse range of organizations, recognizing the varied landscape of the rapidly evolving industry. By offering more affordable options for smaller entities and research groups, the association aims to encourage broad participation and collaboration within the microLED community.

We're happy to introduce the Fraunhofer IZM, a research institute that is a part of the Fraunhofer-Gesellschaft, that specializes in applied and industrial research in packaging technologies and integrating multifunctional electronics into systems. With over 400 employees across four departments, it provides expertise in microelectronics packaging from concept to reliability.

The Fraunhofer IZM's microLED project is led by Dr. Oppermann, IZM’s Deputy Head of Department and Dr. Manier, R&D project engineer. Dr. Opperman has led the "Fine Pitch Assembly and Interconnects" group at Fraunhofer IZM since 1999, focusing on flip chip, die attach, and wafer-level packaging for MEMS, RF, opto, and power applications. His innovations include AuSn soldering, transient liquid phase bonding, nanometal bonding, and Indium bonding. Dr. Manier has contributed to flip chip and die bonding technologies in MEMS, power electronics, and medical applications. He has been involved in European and industry projects, including chip-to-chip/substrate bonding and vacuum-tight MEMS sealing.

Dr. Oppermann and Dr. Manier recently finalized a techblick feasibility study into microLED massive parallel assembly and interconnection.

_{Fig 1. SEM imaging of assembled micro-display of Figure 1 with 3 different small die (RGB) soldered on target substrate}

MicroLED-Connect and AR-Connect will host a two-day virtual conference on March 6-7, only three days from now. This exciting event brings you a curated agenda on MicroLED and AR/VR Display technologies from around the world, featuring speakers from Japan, Korea, Taiwan, Australia, Poland, France, Israel, Germany, Belgium, Canada and east, central and west USA!

The virtual 2-day conference will include over 25 exciting talks by leading microLED developers, AR/VR developers, supply chain companies and top-edge researchers. This will be an excellent opportunity to learn and connect with the microLED industry, on an easy to access virtual event. You can register here, with a yearly pass to MicroLED-Connect (with an option to also include entry into our September on-site event in Eindhoven, The Netherlands). Our members also gain access to past event recordings. We have arranged a remarkable agenda, which you can check below:

The MicroLED Industry Association launches a new project to initiate an international microLED standard. The association recognizes the need to align microLED developers and make sure the the industry progresses in a unified way as there are many challenges towards full scale microLED production - and adoption.

MicroLED Industry Association members will meet on March 24 to discuss the proposed project and select the companies that will lead the standard drive. 

The MicroLED Industry Association published the second edition of its soft-standard document, that focuses on microLED microdisplays. The new edition adds to the original document, with a discussion on system performance and more system considerations.

Most analysts and developers agree that the AR market is one of the targets for microLED displays. MicroLED microdisplays offer many advantages for AR developers – mainly very high brightness and high efficiency. In this soft-stsandard document, the MicroLED Industry Association provide guidelines for microdisplay developers and device makers, identifying the different properties of microLED microdisplays and microdisplays-based systems and suggesting how to disclose display metrics and performance.

MicroLED Connect, our hybrid event series focusing on the microLED industry, will be hosting a two-day virtual event focused on MicroLED and AR/VR innovations, technologies, manufacturing, markets and more. The online event will take place on March 6-7, and will be an excellent opportunity to learn the latest microLED and AR/VR updates and connect with industry professionals on our excellent online event platform.

Today we have published the agenda for this event, which you can also see below, with over 25 exciting talks by leading microLED developers, AR/VR developers, supply chain companies and top-edge researchers. This will be an excellent opportunity to learn and connect with the microLED industry. You can register for the event here, with a yearly pass to MicroLED-Connect (with an option to also include entry into our September on-site event in Eindhoven, The Netherlands). Our members also gain access to past event recordings.

The MicroLED Industry Association has published its 2025 MicroLED Industry Roadmap and State-of-the-Industry document. 

The 2025 MicroLED Roadmap covers the latest microLED technology trends, details the MicroLED Association’s roadmap and projections for the future of the microLED industry and market, by application segments. The summary edition can be downloaded here.

MicroLED Industry Association members can access the full document here, which includes detailed insights into technology and architectures, challenges and forecasts.

MicroLED-Connect is a hybrid event series, a year-long program of virtual and onsite events, all focused on the microLED industry. The 2nd flagship MicroLED Connect display conference will take place in Eindhoven, The Netherlands, on September 23-25, co-located with the 1st AR/VR-Connect conference.

Following a very successful 2024 event, MicroLED-Connect 2025 is set to be an even better event, with an expanded agenda. We already confirmed some early speakers (including Google, PlayNitride, The University of Michigan, Aegis Rider, Aledia, Ingantec, LAM Research, AIST, DELO, the Holst Centre, and more) and have posted a call-out to potential speakers for the event. Companies, research institutes, start-ups, analysts, and academics are all welcome to propose a talk. We encourage contributions from round the world. In general, we prefer talks which represent state-of-the-art technologies or real commercial and industrial impact.

The MicroLED Industry Association’s 2025 annual meeting dinner will be held during Touch Taiwan 2025, in Taipei (which will take place at Taipei Nangang Exhibition Center). This dinner will be an excellent opportunity for MicroLED Association members to connect in a friendly environment.

The dinner meeting will take place at the 1010 Hunan Cuisine restaurant, located only 5 minutes walk from the Exhibition Center. We hope to meet all our members and enjoy a unique dinner experience and networking!

We welcome everyone to join us for a free virtual conference that will focus on display and printed electronics innovations. The event will take place on December 11, 2024. Please click here to register for this exciting event. Like all MicroLED-Connect event, it is organized by TechBlick and the MicroLED Industry Association.

This event is perfect for engineers, researchers, entrepreneurs, managers, inventors, and end users from around the world, who wish to learn more about the latest display innovations, with a focus on microLEDs and AR/VR technologies. 

The vent will include lectures from dozens of companies, including Coherent, Konica Minolta, SCIL, Polar Light Technologies, VueReal, Finetech, XTPL, 3D Micromac, DELO, CEA/Leti, Yole Intelligence, Instrument Systems, Hamamatsu, and many more. You can click on the image above the full agenda.