Ingantec

US-based Ingantec announced that it has managed to deposit 5-micron red InGaN microLEDs, that demonstrate a peak EQE of over 20% at 620nm. The devices were fabricated on conventional c-plane epitaxial structures.

Ingantec's CEO and co-founder, Alan Yeung, presented these results at our MicroLED-Connect event last week in Eindhoven, demonstrating red InGaN emission near 620-625 nm, with peak EQE occurring at 4-5 A/cm², the current density at which the devices reach their reddest emission. The devices subsequently maintain high single-digit efficiency (5-8% EQE) at elevated current densities spanning 40-140 A/cm².

We’re pleased to feature Ingantec, fabless semiconductor and microLED solution provider, in our latest MicroLED Industry Association spotlight series.

We spoke with Alan Yeung, Ingantec's CEO and co-founder, to learn more about the company's technology, business, achievements and goals.

Can you introduce your company and technology?

Ingantec is a fabless semiconductor and microLED solution provider. Our mission is to remove the constraints blocking the commercialization of full-color, monolithic microLEDs. We achieve this through breakthroughs in native InGaN red emission—leveraging strain engineering, defect shielding and spectral stabilization. Our core platform enables two major advancements: 

US-based Ingantec announced that it has licensed a portfolio of patents and pending patents from Yale University, 20 issued patents and filings, covering key innovations in III-nitride optoelectronic devices, methods, and manufacturing processes.

The patents and IP include epitaxial growth and electrochemical etching techniques that utilize nanoporous GaN layers for advanced lattice strain engineering. Ingantec says that these technologies provide novel approaches for controlling material properties in GaN and related semiconductor alloys, with the potential to improve electrical, optical, and structural performance.

US-based Ingantec announced an exclusive licensing agreement with the Wisconsin Alumni Research Foundation (WARF), for its patents in advanced strain engineering and the utilization of pseudo-substrates—technologies.

Ingantec says that the licensed IP, developed by University of Wisconsin-Madison Professors Shubhra Pasayat and Chirag Gupta, utilizes porosification and electrochemical etching techniques to create strain-relaxed Indium Gallium Nitride (InGaN) templates. Inagntec says that these methods may hold promises for solving the “green gap” problem —the precipitous drop in efficiency as InGaN based microLEDs move from blue to green and red.  

The MicroLED Industry Association (MIA) welcomes its newest member companies - Advanced View Technology, Hexagem, Ingantec, Innovision and Verticle. The MIA aims to accelerate the adoption of microLED display technologies, bringing together companies, researchers and organizations active in the MicroLED industry and providing an ideal forum for solving common technology issues, fostering cooperation and sharing relevant information, resources and tools.

Advanced View Technology is a next-generation display technology company focused on advancing MicroLED and NanoLED manufacturing for a wide range of applications. At the core of its innovation is a proprietary electrofluidic assembly technology, designed to enable precise, scalable, and cost-effective integration of micro-scale light-emitting devices. By leveraging this unique platform, Advanced View is developing manufacturing solutions that extend beyond AR/VR applications to include mobile displays, AR-HUD systems, and large-area displays. The company’s technology is aimed at overcoming key challenges in MicroLED commercialization, including transfer accuracy, scalability, yield, and platform versatility, while enabling high-brightness, high-efficiency, and long-lifetime display performance.

“Advanced View is pleased to join the Micro LED Association and connect with global leaders across the ecosystem. Through our proprietary electrofluidic assembly technology, we look forward to contributing to the advancement of scalable MicroLED manufacturing and accelerating adoption across diverse applications ranging from AR/VR and mobile to automotive AR-HUDs and large displays.”

MicroLED Connect, our hybrid event series focusing on the microLED industry, will be hosting a two-day virtual event focused on MicroLED and AR/VR innovations, technologies, manufacturing, markets and more. The online event will take place on March 6-7, and will be an excellent opportunity to learn the latest microLED and AR/VR updates and connect with industry professionals on our excellent online event platform.

Today we have published the agenda for this event, which you can also see below, with over 25 exciting talks by leading microLED developers, AR/VR developers, supply chain companies and top-edge researchers. This will be an excellent opportunity to learn and connect with the microLED industry. You can register for the event here, with a yearly pass to MicroLED-Connect (with an option to also include entry into our September on-site event in Eindhoven, The Netherlands). Our members also gain access to past event recordings.

US-based Ingantec announced that it has entered into an exclusive patent licensing agreement with the University of California Santa Barbara (UCSB). Under the agreement, Ingantec has acquired the exclusive rights to patents that cover innovative systems and methods for achieving industry-leading devices using Metal-Organic Chemical Vapor Deposition (MOCVD) as well as other growth and fabrication processes.

Ingantec will use the technology developed at UCSB to produce highly-efficient next-generation microLED devices. The company is focused on developing efficient native GaN red devices.