Compound Photonics

In 2020 Compound Photonics (CP) announced its high-performance IntelliPix microLED microdisplay backplane technology. CP's backplane supports resolutions up to 2048x2048 and a pixel pitch from 1.5 um and up.

Compound Photonics now announced a partnership with specialty foundry GLOBALFOUNDRIES (GF) to produce the IntelliPix backplanes. CP's devices will be realized on GF’s best-in-class 22FDX specialty semiconductor platform.

In May 2020, Compound Photonics (CP) announced that its high-performance digital backplane is available for microLED developers to integrate into complete microdisplay subsystems. In August 2020 CP formally announced the platform, under the IntellPix brand.

Compound Photonics now announced the MicroLED Innovation Acceleration Center (MiAC) in Chandler, Arizona. CP says that the MiAC (which will inaugurate in January 2021) will be the first industry known fab in the world dedicated to accelerate the time-to-market of sub 5 μm pixel monolithically integrated microLED displays. The facility will serve as a hub for microLED developers that want to use the workspace to deliver innovative process solutions to accelerate microLED R&D - from prototypes to products.

Compound Photonics announced a new partner ship with Axus Technology to help accelerate MicroLED microdisplay development. The two companies will integrate critical wafer-scale processes needed for mass-production scale of CP's microLED displays.

Specifically, Axus will deploy its Capstone CMP system with integrated post-CMP clean to enable wafer planarization and surface preparation process solutions for successful wafer-scale bonding of microLED wafers to high-performance CMOS backplanes.

In May 2020, Compound Photonics (CP) announced that its high-performance digital backplane is available for microLED developers to integrate into complete microdisplay subsystems. The company yesterday formally announced the platform, under the IntellPix brand.

Compound Photonics says that its microdisplay platform will be available to demo in early 2021. The backplane supports resolutions up to 2048x2048 at pixel pitches from 1.5um and up. CP says its backplanes offer low latency, high modulation speeds, constant current technology and a MIPI interface.

Compound Photonics (CP) announced that its high-performance digital backplane is available for microLED developers to integrate into complete microdisplay subsystems. CP re-engineered its existing LCoS backplane to drive microLED pixels. The backplane supports 0.26" FHD displays.

microLED developers can utilize this backplane and also use CP's monolithic integrated display module that supports a direct MIPI input and 240Hz refresh rates, packaged into a compact subsystem.

In October 2019 MicroLED microdisplay developer Plessey Semiconductor announced a partnership with Compound Photonics to co-develop microLED display modules. The two companies announced today that the first fully addressable microLED display module was produced and tested.

Plessey says that this first functioning microLED prototype validates the successful bonding of Plessey’s GaN-on-Si microLED array wafer to CP's high-performance 3.015 micron pixel 1080p backplane wafer. The module that was produced (shown above) is a 0.26" FHD monochrome native-green display.

UK-based GaN-On-Si MicroLED microdisplay developer Plessey Semiconductor announced that it has entered into a partnership with microdisplay system developer Compound Photonics to co-develop a Full-HD (1920x1080) 0.26-inch microLED display solution. The two companies expect to start offering samples in mid-year 2020 (not clear if these will be monochrome or full-color).

For this display system, Plessey will bond its micro-LED array wafer on Compound Photonics' backplane silicon wafer. The display module itself will be based on Compound Photonics’ NOVA digital drive architecture with MIPI input.