Micro-LED Production

We're happy to introduce the Fraunhofer IZM, a research institute that is a part of the Fraunhofer-Gesellschaft, that specializes in applied and industrial research in packaging technologies and integrating multifunctional electronics into systems. With over 400 employees across four departments, it provides expertise in microelectronics packaging from concept to reliability.

The Fraunhofer IZM's microLED project is led by Dr. Oppermann, IZM’s Deputy Head of Department and Dr. Manier, R&D project engineer. Dr. Opperman has led the "Fine Pitch Assembly and Interconnects" group at Fraunhofer IZM since 1999, focusing on flip chip, die attach, and wafer-level packaging for MEMS, RF, opto, and power applications. His innovations include AuSn soldering, transient liquid phase bonding, nanometal bonding, and Indium bonding. Dr. Manier has contributed to flip chip and die bonding technologies in MEMS, power electronics, and medical applications. He has been involved in European and industry projects, including chip-to-chip/substrate bonding and vacuum-tight MEMS sealing.

Dr. Oppermann and Dr. Manier recently finalized a techblick feasibility study into microLED massive parallel assembly and interconnection.

_{Fig 1. SEM imaging of assembled micro-display of Figure 1 with 3 different small die (RGB) soldered on target substrate}

China-based San'an Optoelectronics is experiencing increased demand for its microLED wafers, and the company is expanding its production capacity. San'an currently has the capacity to produce 250 6" microLED wafers per month, and by the end of the quarter, it will be increase its capacity to 1,400 monthly wafers.

San'an also has passed Samsung's audit and microLED validation tests for its latest chips, and the company is now entering into Samsung's supply chain for the company's large-area tiled Wall microLED TVs. 

France-based microLED developer and MicroLED Association member Aledia announced that it has finished the construction of its $200 million microLED production line in Grenoble, and the company is now starting to produce AR microLED microdisplays based on its 3D Nanowire platform.

The new microLED microdisplays are full color displays, based on monolithically grown native red, green and blue devices. The company says that is 3D GaN Nanowire material platform is more efficient and bright than regular (2D) LEDs. The company grows the LED on 8-inch and 12-inch silicon wafers, and can currently ramp up to almost 20,000 monthly wafers.

A year ago Foxconn announced a strategic partnership with Porotech to co-develop microLED microdisplays, targeting AR, wearable and other applications. Foxconn said that this partnership will utilize Porotech's Dynamic Pixel Tuning color-tunable GaN-on-Silicon microLED technology and Foxconn's technologies in semiconductor wafer manufacturing, packaging, IC drivers, CMOS backplanes, module assembly and system assembly.

According to a new report from China, Foxconn plans to build a microLED epiwafer production line in Taichung, Taiwan. Foxconn aims to start mass production by the end of 2025.

China-based MicroLED microdisplay developer Jade Bird Display have developed a full-color microLED microdisplay that achieves a brightness of 2 million nits (white-balanced).

JBD says that its Phoenix series RGB microdisplays offer a pixel pitch of 5 micron, an ultra-thin stack of less than 5 micron, native RGB emitters and high color fidelity. JBD hopes to commercialize its full color microdisplays in Q3 2025. 

A state-of-the-art GaN production facility in Europe has been put up for sale. As per the seller, the facility offers extensive GaN capabilities as well as a track record of doing high-volume CMOS production. The facility include 40,000 sqft of cleanroom space, and about 200 process tools (80% of which are 200 mm). This facility is currently engaged in R&D development and low-volume micro LED manufacturing with existing profitable revenue. The identity of the seller has not been published.

The sell has exclusively retained ATREG to handle the sale. ATREG says that the facility is offered with a comprehensive IP portfolio, over 250 skilled employees (of which 110 are engineers), and specialized capabilities in MOCVD, CMP, and wafer bonding. In addition to the current micro LED capabilities, the fab is suited for GaN power devices, advanced photonics, GaAs processing, and MEMS/sensors manufacturing. The fab has received significant investment over the past five years, including sub-fab upgrades, cleanroom expansion, utility improvements, and other facility upgrades.

Tianma Microelectronics announced that it has developed a new side wiring technology that enables completely seamless tiled microLED displays. The new technology is based on a new process that is much more cost effective compared to other processes, in fact Tianma says it can reduce the cost of side wiring deposition by up to three times.

Tianma shared some details about its first tiled microLED displays. These offer a very small pixel pitch of 0.4 mm, and are based on an LTPS backplane. Tianma also revealed that it is using a laser-based transfer process. The company is now running trial production, and it hopes to improve the yields and production efficiency in 2025, and then move to small batch mass production.

Aixtron announced its financial results for Q3 2024, with solid orders and revenue, despite a slight miss on guidance due to a project delay. This project was a large order for a microLED customer, with tools shipments pushed to December instead of October.

Aixtron says that "despite the news from Apple and ams OSRAM" the microLED industry is continuing to work on the technology, and the company received orders from several customers building R&D and pilot production lines. Aixtron expects its microLED revenues in FY2024 to be at high double-digit million euros.

During the company's recent conference call, AUO said that the company is "making significant progress" in MicroLED technology, transitioning to a 4.5-Gen line. AUO's current microLED production line is referred to as a 1-Gen line, used to produce commercial wearable displays (although we understand yields are very low and production costs are still extremely high). The company hopes its new larger line will improve production efficiency and cost structure.

AUO said that the new production line will enable it to start producing automotive displays, which are expected to launch by 2026 or 2027.

In August 2023, China-based BOE HC Semitek started building its $700 million microLED epiwafer production line in Jinwan District, Zhuhai, China.

The company now held a ceremony marking the beginning of sample wafer production at the new line. This is the first phase of this project, and total investment to date is $275 million. It is likely that ramping up will take some time and full scale production of the first phase will take place later in 2025. When the fab is complete, with all three phases, it will have a yearly capacity of 58,000 6-inch microLED wafers.