The UK Government announced a £160 million ($216 million USD) investment to support several projects in Scotland, including a new center at the University of Strathclyde to support UK and international customers with lab-to-scale packaging of semiconductor components for critical applications.
The new National Advanced Semiconductor Packaging and Integration Centre (NASPIC) will support next-generation technologies, from AI to photonics, and will host state-of-the-art equipment that will allow partners to prepare and dice wafers, mount and connect devices, conduct testing, and seal devices in the final package. One of the methods and processes adopted by the NASPIC will be the continuous roller microLED transfer-printing process developed at the University of Strathclyde - a process that can be used to transfer microLEDs.
