GE and Current Lighting Solutions to develop PFS/KFS phosphors for microLED applications

GE and Current Lighting Solutions have signed a collaboration agreement on small-size Potassium Fluorosilicate (PFS/KSF) phosphor for MiniLED and MicroLED applications. The two companies have a long-standing relationship in the world of PFS/KSF phosphor, and this new agreement extends their previous agreements.

The two companies will develop advanced versions of KSF Red Narrowband phosphor with material properties required to enable the use of these materials in advanced display technology such as emissive microLEDs. GE has the exclusive rights to license KSF technology for display applications and will work with display companies to license KSF technology into these advanced displays.

Read the full story Posted: May 14,2021

Rohinni designed a parallel-design for its miniLED bondhead equipment to achieve 14X placement speed boost

Micro-LED and mini-LED developer Rohinni announced that the company has developed a new design for its miniLED composite bondhead, which now allows multiple bondheads to run in parallel. Rohinni says it has been able to accelerate its miniLED deposition speed 14X compared to 'competing technologies'.

Rohinni miniLED bondhead deposition photo

With the new system, Rohinni demonstrated >99.999% placement yield and scalability at speeds greater than 100 die per second. 

Read the full story Posted: May 01,2021

Ennostar to gradually upgrade its Taiwanese LED facilities to microLED production

In 2020 Taiwan's LED developers Epistar and Lextar announced plans to establish a joint holding company, effectively merging the two companies, into Ennostar Incorporation.

During a recent investor conferences, Ennostar's CEO said that Epistar will gradually upgrade its miniLED production line in Taiwan to produce microLED chips. The plan is to reach a yearly capacity of over 400,000 6" microLED wafers. In the long term the company will focus its microLED production in Taiwan, while its Chinese factories will produce miniLEDs.

Read the full story Posted: Mar 20,2021

STAr Technologies introduces a new integrated test system for MicroLED devices

Taiwan-based STAr Technologies launched a new inspection system for MicroLEDs and mini-LEDs devices. the Unicorn-LAIT is an integrated system with parallel test instrument, probe station and probe cards and can meet mass production needs.

STAr Technologies' Unicorn LAIT Micro LED test system photo

STAr says that its new system enables alignment of up to 6-inch wafers and probe cards for automatic probing test. The parallel test instrument will be based on STAr Taurus-LPX with PMU capable of performing 48 to a maximum of 240 LEDs in parallel. Attributed to the efficient system structure, The STAr Unicorn-LAIT is suitable for the LED industry chip maker and optical devices manufacturer.

Read the full story Posted: Mar 20,2021

San'an plans to start production trials at its new mini-LED and micro-LED production site in Hubei

In 2019 San'an Optoelectronics announced that it aiming to build a $1.78 billion Mini-LED and Micro-LED production site in Hubei, with plans to start production in March 2021. Later it was reported that the construction is delayed due to the Covid-19 pandemic.

Sanan microLED miniLED production site at Hubey (March 2021)

According to the latest news from China, the production is actually progressing well and San'an plans to start trial production by the end of the month. The second stage phase of the construction project is actually starting ahead of schedule - by half a year.

Read the full story Posted: Mar 14,2021

Kulicke & Soffa acquires microLED placement technology developer Uniqarta

Singapore-based electronics assembly solutions provider Kulicke & Soffa announced that it has acquired Uniqarta, a US-based developer of MicroLED placement technology.

Uniqarta LEAP microLED placement technology illustration

Uniqarta developed a unique LED die transfer technology that uses ultra-fast lasers to enable contactless LED de-bonding and placement solution. Uniqarta's technology is branded as Laser-Enabled Advanced Placement, or LEAP).

Read the full story Posted: Feb 06,2021

Rohinni doubles the speed of its mini LED placement process

Micro-LED and mini-LED developer Rohinni said that it developed a new placement technology for mini-LED that doubles the placement speed compared to its previous technology.

Rohinni - Luumii flexible keyboard LEDs photo

Rohinni developed a new bondhead which achieves a 100 Hz placement operation which effectively cuts in half the cost of placing mini LEDs. The technology will be deployed in the first part of 2021.

Read the full story Posted: Jan 12,2021

Epistar and Lextar formally merge, Ennostar Incorporation is established

In 2020 Taiwan's LED developers Epistar and Lextar announced plans to establish a joint holding company, effectively merging the two companies. Last week the company, called Ennostar Incorporation was formally launched.

Ennostar will focus on rapid development of mini-LED and micro-LED technologies and displays. The company has three main areas, divided between its daughter companies: Epistar will focus on LED epitaxy and chip, Lextar will focus on packaging and module, and Unikorn Semiconductor Corp. (under Epistar) will develop advanced compound semiconductor foundry.

Read the full story Posted: Jan 11,2021

San'an resumes constructing its $1.8 billion miniLED and microLED production site in Hubei

In 2019 San'an Optoelectronics announced that it aiming to build a $1.78 billion Mini-LED and Micro-LED production site in Hubei. The project will include a LED production plant, an R&D center and also a sales offices.

Sanan Hubei microLED project construction photo

The plant construction was said to take up to 3 years, and production to begin a year later. According to a news report from China, construction was delayed due to the COVID pandemic, but Sanan now resumed construction the new facility.

Read the full story Posted: Nov 12,2020

VerLASE reports it has achieved substantial progress in its micro-LED display transfer technology

US-based parallel microLED assembly technology developer VerLASE Technologies reports today that it has achieved substantial progress in its mass transfer process for micro-LED displays.

VerLASE microLED transfer process scheme

VerLASE now plans to develop the process flow for an assortment of dies sizes from 200 X 200 um (mini-LEDs) down to 10 X 10 um and eventually also 5x5 um. VerLASE plans to demonstrate the transfer of both flip-chip, and vertical thin film LED architectures.

 

Read the full story Posted: Nov 01,2020