3D-MicroMac

3D-Micromac sold several LLO systems for the production of microLED devices in Asia

3D-Micromac announced that a leading optical solutions provider has purchased several microMIRA laser lift-off (LLO) systems to use in the production of microLED devices. The systems will be installed in pilot lines and production lines at its state-of-the-art LED chip factory in Asia

3D-Micromac says that the microMIRA laser system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer's unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

Read the full story Posted: Nov 08,2022

The MicroLED Industry Association begins operations, welcomes new members

The MicroLED Industry Association (MIA) successfully concluded its kickoff meeting on August 2nd. The work plan for the coming quarter was announced, and the association members were updated on work processes, collaboration activities and plans for the future.

 

The MIA is happy to announce that there are already over 15 members in the microLED association. In addition to its pre-launch founding members, the MIA welcomes the new members that joined since the official announcement on July 13. These companies include 3D Micromac, ASM Pacific Technology group, ClassOne Technology, Radiant Vision Systems and the Ennostar group (Epistar, Lextar, Yenrich and Unikorn).

Read the full story Posted: Aug 03,2022

3D-Micromac launches a new microLED LIFT mass transfer tool

3D-Micromac announced a new microLED mass transfer tool, called microCETI. The company says its new technology can be used to transfer over 130 million microLEDs per hour.

MicroCETI is based on a laser-induced forward transfer (LIFT) process that can support almost any microLED material and shape. The tool also includes optional modules - a laser lift-off (LLO) module, and a single LED die repair module.

Read the full story Posted: May 17,2021