OTFT developer Smartkem demonstrated a 12.3" MicroLED-in-a-Package (MiP) backlighting unit, based on its unique and proprietary technology. At the core of this development is Smartkem's proprietary Redistribution Layer (RDL) material, which interconnects four chip-first MicroLEDs in a series to form a single high-voltage chip—the MiP4.
Smartkem says that its MiP4 package is designed to replace existing MiniLED packages in LCD backlights and signage applications, offering higher brightness, high efficiency, low production cost and compatibility with existing MiniLED die bonding equipment.
Smartkem's OTFT backplane materials are deposited using a low temperature process, which means they can be deposit after the LEDs are placed. This is the basis of the company's 'chip-first' MicroLED architecture.
