According to reports from Taiwan, Intel has developed a new technology to enable more efficient embedding of microLED into glass substrates via novel through-glass vias (TGVs), with an am to achieve deep optoelectrical integration. The company is in talks with AUO to partner on advanced co-packaged optics (CPO, or microLED-based optical I/O).
It is reported that Intel sees AUO as an important ally, as it challenges TSMC's leadership in AI chip technologies. AUO has deep knowledge and experience in glass processing, required for Intel's CPO solutions.
In addition to Intel, AUO is working closely with Ennostar and Tyntek and has already demonstrated a microLED based optical I/O solution. The company is also co-developing 3D Nanowire microLED based optical I/O technologies together with Aledia.
Earlier this year, AUO said that it plans to commercially launch new advanced CPO solutions, targeting AI datacenters, within 2-3 years. The company says it believes microLED-based CPO can be highly suitable for data-transmission cables up to 10m in length, and is excited about this opportunity. AUO believes it will be able to commercialize this technology into a product within 2-3 years.
