Hyperlume raises $12.5 million to develop a low energy microLED-based optical interconnect solution

Canada-based Hyperlume announced that it has raised $12.5 million USD in its seed round, led by BDC's Deep Tech Venture Fund and ArcTern Ventures with participation from MUUS Climate Partners, SOSV, LG Technology VEntures and Intel Capital.

Hyperlume was established in 2022 to develop a low-energy optical interconnect solution for chip-to-chip communication. The company's technology relies on microLED arrays to enable high bandwidth and lower power consumption.

Posted: Feb 20,2025 by Ron Mertens