Hyperlume

Last updated on Tue 11/08/2026 - 07:41
Company Type:  

Canada-based Hyperlume was established in 2022 to develop a low-energy optical interconnect solution for chip-to-chip communication. The company's technology relies on microLED arrays to enable high bandwidth and lower power consumption.

In early 2025, the company raised $12.5 million USD in its seed round. In September 2025, the company was acquired by Credo.

Contact information for Hyperlume

Company Address

7 Bayview Station Road,
Ottawa ON
Canada

Trendforce projects that the microLED-based CPO market will emerge in 2028, reaching $848 million by 2030

TrendForce says that microLED-based optical communication, offering low power consumption and low error rates, is emerging as one of the three major short-distance, high-speed intra-rack transmission solutions for scale-up data center networks, alongside active electrical cables (AEC) and VCSEL-based near-packaged optics (VCSEL NPO). 

The high demand for AI datacenter communication solutions, will drive fast growth, and Trendforce projects that microLED co-packaged optics (CPO) will start to scale up in the second half of 2028, and will quickly ramp up to $848 million by 2030. 

Read the full story Posted: May 13,2026

Credo reveals it paid $92 million to acquire microLED optical I/O developer Hyperlume

In September 2025, high-speed connectivity solution developer Credo announced that it has acquired microLED-based chip-to-chip optical interconnect developer Hyperlume. The financial terms of the acquisition were not disclosed.

During Credo's recent SEC filing, Credo reveals that it has paid $92 million, in cash, to acquire Hyperlume. When Credo acquired the company, it had about $9 million in cash, from its $12.5 million seed round that it has raised earlier in 2025. This means that the value of Hyperlume was about $83 million.

Read the full story Posted: Apr 16,2026

Trendforce: microLED optical interconnects are dramatically more efficient than copper-based interconnects

MicroLED-based optical interconnects are getting a lot of attention lately, as AI datacenters demands drive innovation and funds into the optical interconnect market.

According to TrendForce, microLED-based optical interconnect solutions are drastically more power efficient compared to copper-base solutions - in fact the overall microLED I/O system power consumption can be reduced to around 5% of the consumption of copper based systems.

Read the full story Posted: Mar 04,2026

CEA-Leti to launch a multi-year collaborative program to develop microLED based AI optical interconnects

The CEA-Leti institute in France (a MicroLED Industry Association member) launched a new three-year multilateral program to develop ultra-fast data transfer based on microLED, with an aim to accelerate AI datacenters.

This new lab-to-fab initiative is set to begin in January 2026, and it will engage companies that develop microLEDs, optical fibers, photodiodes, and interconnects, as well as chipmakers, system integrators, and hyperscalers. CEA-Leti believes that microLED-based communication can be more energy efficiency than both copper-based systems, and laser-based ones. CEAT-Leti will lead the Multilateral MicroLED Data Link Program with financial backing from its industrial partners.

Read the full story Posted: Nov 18,2025

Credo acquires microLED optical interconnects developer Hyperlume

High-speed connectivity solution developer Credo announced that it has acquired microLED-based chip-to-chip optical interconnect developer Hyperlume. The financial terms of the acquisition were not disclosed.

Earlier this year, Hyperlume raised $12.5 million USD in its seed round. Hyperlume was established in 2022 to develop a low-energy optical interconnect solution for chip-to-chip communication.

Read the full story Posted: Sep 30,2025

Hyperlume raises $12.5 million to develop a low energy microLED-based optical interconnect solution

Canada-based Hyperlume announced that it has raised $12.5 million USD in its seed round, led by BDC's Deep Tech Venture Fund and ArcTern Ventures with participation from MUUS Climate Partners, SOSV, LG Technology VEntures and Intel Capital.

Hyperlume was established in 2022 to develop a low-energy optical interconnect solution for chip-to-chip communication. The company's technology relies on microLED arrays to enable high bandwidth and lower power consumption.

Read the full story Posted: Feb 20,2025