Last month, we reported that Kopin and Fabric.AI launched a strategic collaboration to develop microLED-based optical interconnect technology (which will branded as Neural I/o) for AI infrastructure. Fabric.AI placed a $15 million purchase order with Kopin to fund the demonstration chipset development.
Fabric.AI now announced that it expects to demonstrate its Neural I/o platform by the end of 2026. It has also entered into two non-disclosure agreements with leading chipmakers to discuss potential applications and integration opportunities for Neural I/o within next-generation AI systems.
Fabric.AI believes MicroLED-based interconnect architectures may offer substantial advantages over traditional copper and laser-based solutions, including lower power consumption, lower latency, improved thermal efficiency, greater density, and superior scalability for hyperscale AI environments.
