The CEA-Lei institute in France (a MicroLED Industry Association member) launched a new three-year multilateral program to develop ultra-fast data transfer based on microLED, with an aim to accelerate AI datacenters.
This new lab-to-fab initiative is set to begin in January 2026, and it will engage companies that develop microLEDs, optical fibers, photodiodes, and interconnects, as well as chipmakers, system integrators, and hyperscalers. CEA-Leti believes that microLED-based communication can be more energy efficiency than both copper-based systems, and laser-based ones. CEAT-Leti will lead the Multilateral MicroLED Data Link Program with financial backing from its industrial partners.
MicroLED-based optical interconnects are being developed by several companies, including Avicena, that recently announced a major milestone as it has demonstrated a fully operational microLED-based optical link operating at an industry-leading Tx power of 200 femtojoules per bit, and Hyperlume that was recently acquired by Credo.
