CEA-Leti

MicroLED Connect 2026 is set to be the industry's premier event for microLED and next-generation display technologies, taking place on 16-17 September 2026 at the High Tech Campus in Eindhoven, The Netherlands, with a world-class agenda, exhibition and networking opportunities. The event spans three co-located tracks - MicroLED, AR/VR and Optical I/O - covering everything from microLED manufacturing and displays to AR/VR optics and optical interconnects for AI infrastructure.

Here we will introduce some of the speakers and themes from the Optical I/O track, a unique forum bringing together the display, semiconductor and AI industries to address one of the defining challenges of the AI era: the interconnect bottleneck. You can explore the full agenda and event details here.

MicroLED Connect 2026, the premier industry event dedicated to microLED technologies, will bring together leading companies, researchers, and innovators from across the display and semiconductor ecosystems for a focused program of talks, networking, and technology insights.

As part of this year’s event, which will take place on 16-17 September at Eindhoven's High tech Campus, a dedicated full-day “Optical I/O Connect” session will highlight one of the most important emerging directions in the field.

The CEA-Leti institute in France (a MicroLED Industry Association member) announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC) and the smart digital system specialist institute, CEA-List, to introduce high-bandwidth communication and high-efficiency computing technologies into PSMC’s established 3D stacking and interposer platforms.

The three partners aim to deliver solutions for next-generation artificial intelligence (AI) systems, by integrating short-reach, high-bandwidth optical links for energy-efficient data movement and customizable RISC-V processor architectures. 

The MicroLED Industry Association is excited to announce its activities for SID DisplayWeek 2026, taking place this May in Los Angeles, California. This year marks an important step forward for our community: in addition to our traditional Annual MicroLED Association Dinner, we will for the first time host a dedicated MicroLED Association Pavilion on the exhibition floor.

The Pavilion will feature six of our leading member companies—ADEIA, CEA-Leti, ETRI, Polar Light, QustomDot, and WEVE—each showcasing their latest innovations and technologies advancing the microLED industry. Visitors will have the opportunity to explore a diverse range of new solutions spanning materials, processes, equipment, and system integration, all driving the next generation of display performance.

Researchers at the CEA-Leti institute (a MicroLED Association member institute) developed green and red-emitting thin-film perovskite color conversion layers (CCLs) using pulsed laser deposition (PLD), that can be used in microLED microdisplays.

The researchers say that while QDs provide a good solution for color conversion microLED displays, they suffer from low absorption, which means that require a thickness of 3-10 micron, which is a challenge for very small microLEDs, required for microdisplays.

MicroLED-based optical interconnects are getting a lot of attention lately, as AI datacenters demands drive innovation and funds into the optical interconnect market.

According to TrendForce, microLED-based optical interconnect solutions are drastically more power efficient compared to copper-base solutions - in fact the overall microLED I/O system power consumption can be reduced to around 5% of the consumption of copper based systems.

3D Nanowire MicroLED developer Aledia announced the commercial availability of FlexiNova, its patented high-voltage microLED platform designed to unlock scalable, energy-efficient Direct-View microLED displays for global markets.

15x30 µm² 6V FlexiNOVA microLEDs assembled on a 400 µm pitch backplane 

The company says it is the first in the world to successfully manufacture 3D Nanowire based microLEDs operating at 6V, with an ultra-compact 15 µm × 30 µm single body chip size, manufactured on 200 mm silicon wafers. The company, together with its partner CEA-Leti, is continuing to develop the technology and is developing a full portfolio of 6V and 9V operation with a constant efficiency for chip sizes down to 3.5 µm.

Lam Research signed a multi-year research agreement with CEA-Leti, to advanced the fabrication of next-generation specialty semiconductor technologies. One of the focus areas is microLED displays.

CEA‑Leti said its role will center on rapid materials analysis and device characterization to support faster process optimization.

CEA-Leti has developed a new optical sensing architecture that combines a microLED and an organic photodetector (OPD). This system-level approach,  that combines device design, electronics, and modeling allows for multifunctional display applications, without compromising display performance.

The researchers have optimized both devices to a green wavelength, that is relevant to photoplethysmography (PPG) signal extraction.

The MicroLED Industry Association (MIA) is pleased to announce its upcoming webinar, dedicated to MicroLED-based optical data interconnects.

In this session, we will host leading microLED optical interconnect developer Avicena, and MIA member CEA-Leti. We will discuss microLED solutions for optical interconnects, used for AI datacenters. We’ll talk about the current status of technology, why microLEDs are promising in this application, and more.

This exclusive event offers MIA members an opportunity to learn directly from industry pioneers and world-class researchers and engage in discussions that support the advancement of MicroLED technology worldwide. Registration is open now for MIA members through the association’s member portal.