Avicena raised $65 million in its Series B funding round, to bring its microLED-based chip-to-chip interconnects to market

Avicena, a developer of microLED-based chip-to-chip interconnects, announced that it has secured its Series B funding round, raising $65 million. Avicena raised a total of $120 million to date. 

The B round was led by Tiger Global and other participating VCs include Maverick Silicon, Prosperity7 Ventures, Venture Tech Alliance, SK hynix, Cerberus Capital Management, Hitachi Ventures and Lam Research. The company says it will use the new funds to further scale its team and ramp our first product into production. 

 

A few months ago, Avicena launched its scalable and modular LightBundle interconnect platform, that supports > 1Tbps/mm shoreline density and extends ultra-high density die-to-die (D2D) connections to > 10 meters at class leading sub-pJ/bit energy efficiency.

Avicena, a developer of microLED-based chip-to-chip interconnects, recently discussed its microLED-based solution, as you can see in the video above.

In 2022 the company acquired Nanosys' GaN microLED fab and engineering team. Avicena uses the fab and team to develop and produce high-speed GaN microLEDs optimized for its application. 

Avicena LightBundle microLED array ASIC

The GaN microLED fab was previously owned by glō (before it was acquired by Nanosys), which invested over $200 million in the facilities, which include epitaxy, wafer processing, and lift-off and transfer tools to post-process silicon ICs with optical interfaces.

Posted: May 14,2025 by Ron Mertens