MicroLED-based optical interconnect developer Avicena launched a new version of its LightBundle evaluation kit, supporting 1 Tbps, an improvement over its previous kit launched only a few months ago. These kits offer Avicena's microLED optical connectivity using ASIC-based transceivers with integrated LED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The new kits are now shipping.
Avicena says that its new 1 Tbps LightBundle eKit incorporates a 335-channel microLED array, with each microLED data channel operating up to 3 Gbps, coupled with an Avicena multicore fiber bundle to a 335-element integrated photodiode array. The company says its solution offers low power, high bandwidth density, robust operation at elevated temperatures, and flexible reach beyond the practical limits of copper interconnects. Target use cases include die-to-die and die-to-memory links, XPU-to-XPU connectivity, and XPU-to-switch interconnects.
Avicena is now shipping 1 Tbps LightBundle eKits. Organizations interested in evaluating the platform or discussing LightBundle integration may contact Avicena at nigel@avicena.tech.
The LightBundle eKit is comprised of host interface boards, reference drivers, integrated diagnostics, and a graphical user interface (GUI) driven by a customized software configuration testing platform. This enables engineers to evaluate and characterize microLED interconnect optical signal integrity, link budgets, open eye monitoring, power efficiency, crosstalk performance, and generate bit error rate bathtub curves.
Avicena LightBundle eKit software UI
Meet Avicena Tech at MicroLED Connect 2026
Avicena Tech's Gregoire Denis will be speaking at MicroLED Connect 2026, taking place on 16-17 September 2026 at the High Tech Campus in Eindhoven, the Netherlands. Click here to learn more and register.
