Avicena launched its scalable and modular microLED based interconnect platform

Avicena, a developer of microLED-based chip-to-chip interconnects, launched its scalable and modular LightBundle interconnect platform. 

LightBundle supports > 1Tbps/mm shoreline density and extends ultra-high density die-to-die (D2D) connections to > 10 meters at class leading sub-pJ/bit energy efficiency. Avicena says that its microLED based solution will enable AI scale-up networks to support large clusters of GPUs across multiple racks, eliminating reach limitations of current copper interconnects while drastically reducing power consumption.

The LightBundle interconnect is a modular transceiver chiplet-based architecture. Transceiver chiplets contain integrated microLED and PD arrays that are connected to other LightBundle transceiver chiplets via multi-core fiber bundles. They support dense, low power D2D interfaces such as UCIe or BOW. LightBundle chiplet transceivers are well-suited to various packaging architectures including co-packaged optics (CPO), on-board optics (OBO), and pluggable optical modules as well as active optical cables (AOC). Unlike silicon photonics, LightBundle interfaces can be integrated onto almost any IC process from a wide variety of foundries.

Avicena, a developer of microLED-based chip-to-chip interconnects, recently discussed its microLED-based solution, as you can see in the video above.

Later in 2022 the company acquired Nanosys' GaN microLED fab and engineering team. Avicena uses the fab and team to develop and produce high-speed GaN microLEDs optimized for its application. 

The GaN microLED fab was previously owned by glō (before it was acquired by Nanosys), which invested over $200 million in the facilities, which include epitaxy, wafer processing, and lift-off and transfer tools to post-process silicon ICs with optical interfaces.