Avicena
US-based Avicena, established in 2019, develops high-speed optical chip-to-chip communication devices based on microLEDs. In 2025, Avicena launched its scalable and modular LightBundle interconnect platform.
In May 2025, Avicena announced that it has secured its Series B funding round, raising $65 million. Avicena raised a total of $120 million to date.
In March 2026, Avicena launched an evaluation platform for its microLED optical connectivity using ASIC-based transceivers with integrated microLED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The kit integrates 320 microLED data channels operating up to 3.5 Gbps.
In 2022 the company acquired Nanosys' GaN microLED fab and engineering team. Avicena uses the fab and team to develop and produce high-speed GaN microLEDs optimized for its application. The GaN microLED fab was previously owned by glō (before it was acquired by Nanosys), which invested over $200 million in the facilities, which include epitaxy, wafer processing, and lift-off and transfer tools to post-process silicon ICs with optical interfaces.
Contact information for Avicena
q 1225 Bordeaux Drive
Sunnyvale, CA 94089
United States
Avicena raises $10 million from Intervest
MicroLED-based optical I/O developer Avicena raises $10 million from Korea-based Intervest. Avicena raised $130 million today, with its previous $65 million round B announced last year.
In March 2026, Avicena launched an evaluation platform for its microLED optical connectivity using ASIC-based transceivers with integrated microLED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The kit integrates 320 microLED data channels operating up to 3.5 Gbps.
Avicena launches new higher-performance LightBundle microLED optical I/O evaluation kits, reaching 1 Tbps
MicroLED-based optical interconnect developer Avicena launched a new version of its LightBundle evaluation kit, supporting 1 Tbps, an improvement over its previous kit launched only a few months ago. These kits offer Avicena's microLED optical connectivity using ASIC-based transceivers with integrated LED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The new kits are now shipping.
Avicena says that its new 1 Tbps LightBundle eKit incorporates a 335-channel microLED array, with each microLED data channel operating up to 3 Gbps, coupled with an Avicena multicore fiber bundle to a 335-element integrated photodiode array. The company says its solution offers low power, high bandwidth density, robust operation at elevated temperatures, and flexible reach beyond the practical limits of copper interconnects. Target use cases include die-to-die and die-to-memory links, XPU-to-XPU connectivity, and XPU-to-switch interconnects.
A glimpse into MicroLED Connect 2026: microLEDs take on the AI data center interconnect bottleneck
MicroLED Connect 2026 is set to be the industry's premier event for microLED and next-generation display technologies, taking place on 16-17 September 2026 at the High Tech Campus in Eindhoven, The Netherlands, with a world-class agenda, exhibition and networking opportunities. The event spans three co-located tracks - MicroLED, AR/VR and Optical I/O - covering everything from microLED manufacturing and displays to AR/VR optics and optical interconnects for AI infrastructure.
Here we will introduce some of the speakers and themes from the Optical I/O track, a unique forum bringing together the display, semiconductor and AI industries to address one of the defining challenges of the AI era: the interconnect bottleneck. You can explore the full agenda and event details here.
Trendforce projects that the microLED-based CPO market will emerge in 2028, reaching $848 million by 2030
TrendForce says that microLED-based optical communication, offering low power consumption and low error rates, is emerging as one of the three major short-distance, high-speed intra-rack transmission solutions for scale-up data center networks, alongside active electrical cables (AEC) and VCSEL-based near-packaged optics (VCSEL NPO).
The high demand for AI datacenter communication solutions, will drive fast growth, and Trendforce projects that microLED co-packaged optics (CPO) will start to scale up in the second half of 2028, and will quickly ramp up to $848 million by 2030.
MicroLED Connect 2026 to feature full-day Optical I/O session
MicroLED Connect 2026, the premier industry event dedicated to microLED technologies, will bring together leading companies, researchers, and innovators from across the display and semiconductor ecosystems for a focused program of talks, networking, and technology insights.
As part of this year’s event, which will take place on 16-17 September at Eindhoven's High tech Campus, a dedicated full-day “Optical I/O Connect” session will highlight one of the most important emerging directions in the field.
Avicena launches an evaluation kit for its microLED optical interconnect solution
MicroLED-based optical interconnect developer Avicena launched an evaluation platform for its microLED optical connectivity using ASIC-based transceivers with integrated LED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle.
Avicena says that the new LightBundle eKit enables hyperscaler, AI accelerator, high-bandwidth memory (HBM), networking, and AI infrastructure architects to evaluate next-generation optical links designed to overcome the bandwidth, reach, routing and energy limitations of copper interconnects in AI systems.
Trendforce: microLED optical interconnects are dramatically more efficient than copper-based interconnects
MicroLED-based optical interconnects are getting a lot of attention lately, as AI datacenters demands drive innovation and funds into the optical interconnect market.
According to TrendForce, microLED-based optical interconnect solutions are drastically more power efficient compared to copper-base solutions - in fact the overall microLED I/O system power consumption can be reduced to around 5% of the consumption of copper based systems.
MicroLED Association Webinar: Exploring MicroLED Optical Interconnects with Avicena and CEA-Leti
The MicroLED Industry Association (MIA) is pleased to announce its upcoming webinar, dedicated to MicroLED-based optical data interconnects.
In this session, we will host leading microLED optical interconnect developer Avicena, and MIA member CEA-Leti. We will discuss microLED solutions for optical interconnects, used for AI datacenters. We’ll talk about the current status of technology, why microLEDs are promising in this application, and more.
This exclusive event offers MIA members an opportunity to learn directly from industry pioneers and world-class researchers and engage in discussions that support the advancement of MicroLED technology worldwide. Registration is open now for MIA members through the association’s member portal.
Avicena: our link now operates at 4Gbps per lane with transmitter currents as low as 100µA per LED
Avicena, a developer of microLED-based chip-to-chip interconnects, announced that its LightBundle microLED-based links now operate at 4Gbps per lane with transmitter currents as low as 100µA per LED. At this current, each link closes at a raw BER of 1×10-12 with an equivalent energy of 80fJ/bit per LED, all without Forward Error Correction (FEC).
The company says that this new power-per-lane milestone was enabled by a new high-sensitivity receiver technology, developed in collaboration with the company's manufacturing partners and incorporating optimized photodetectors derived from high-volume image-sensor processes.
CEA-Leti to launch a multi-year collaborative program to develop microLED based AI optical interconnects
The CEA-Leti institute in France (a MicroLED Industry Association member) launched a new three-year multilateral program to develop ultra-fast data transfer based on microLED, with an aim to accelerate AI datacenters.
This new lab-to-fab initiative is set to begin in January 2026, and it will engage companies that develop microLEDs, optical fibers, photodiodes, and interconnects, as well as chipmakers, system integrators, and hyperscalers. CEA-Leti believes that microLED-based communication can be more energy efficiency than both copper-based systems, and laser-based ones. CEAT-Leti will lead the Multilateral MicroLED Data Link Program with financial backing from its industrial partners.
