3D Nanowire MicroLED developer Aledia launched its new FlexiNOVA product-ready epiwafer platform, saying that first samples will be available for customers in the second half of 2025, in both 6V and 9V variants.
FlexiNOVA microLED wafers will be offered to display makers to be integrated into full displays, targeting applications such as wearables, automotive displays, TVs and monitors. The FlexiNOVA platform offers high flexibility in chip size, shape, and power usage.
Aledia says that one of FlexiNOVA’s biggest innovations is its ability to deliver ultra-small chips, ranging from 15×30 µm² down to below 3.5×3.5 µm²—fabricated on 200 mm GaN-on-silicon wafers—while scalability to 300 mm diameter has already been demonstrated. FlexiNOVA is also the first chip format to support built-in multiple voltages, lowering current density and easing electrical stress on TFT backplanes, enabling better thermal management and durability in automotive and battery-powered devices.
Meet Aledia at MicroLED Connect 2026
Aledia's Pierre Tchoulfian, CTO, will be speaking, and Aledia will exhibit at booth A04 at MicroLED Connect 2026, taking place on 16-17 September 2026 at the High Tech Campus in Eindhoven, the Netherlands.
Click here to learn more and register.
