MicroLED Transfer (Pick and place)

Tianma Microelectronics announced that it has developed a new side wiring technology that enables completely seamless tiled microLED displays. The new technology is based on a new process that is much more cost effective compared to other processes, in fact Tianma says it can reduce the cost of side wiring deposition by up to three times.

Tianma shared some details about its first tiled microLED displays. These offer a very small pixel pitch of 0.4 mm, and are based on an LTPS backplane. Tianma also revealed that it is using a laser-bsaed transfer process. The company is now running trial production, and it hopes to improve the yields and production efficiency in 2025, and then move to small batch mass production.

Researchers from Korea's Kookmin University have developed a new GaN-based fin-LED chip material and pixel process technology, saying that this innovation may be the key to overcome the limitations of current microLED technologies.

The researchers developed a viable pixel manufacturing process that vertically assembles sub-micron-sized fin-LEDs using a face-selective dielectrophoresis (DEP) assembly method. The GaN-based sub-micron-sized fin-LEDs are designed to maximize performance while minimizing costs related to the chips and pixelation process. This technology significantly enhances extraction light efficiency by vertically aligning the fin-LEDs, and it enables the implementation of chip materials and pixel manufacturing processes that significantly reduce production costs.

Aixtron announced its financial results for Q3 2024, with solid orders and revenue, despite a slight miss on guidance due to a project delay. This project was a large order for a microLED customer, with tools shipments pushed to December instead of October.

Aixtron says that "despite the news from Apple and ams OSRAM" the microLED industry is continuing to work on the technology, and the company received orders from several customers building R&D and pilot production lines. Aixtron expects its microLED revenues in FY2024 to be at high double-digit million euros.

Researchers from Korea's Kookmin University in collaboration with colleagues from Kyung Hee University have managed to enhance the performance of microLEDs produced using fluidic self-assembly based on chelation bonds of chemical linkers. The researcher report up to 61.8% increase in assembly yield compared to previous methods, and their vertically assembled 1.3 um microLEDs achieved a peak EQE of 8.1% and a brightness of 22,300 nits at 9 V.

The researchers developed a novel approach for the face-selective vertical assembly of microLEDs using a chemical linker capable of engaging in metal chelate coordination interactions within Zn metal complexes.

The Netherlands based roll-to-plate nano-imprinting technology developer Morphotonics announced that it has secured its Series B funding round, raising over $10 million from 3M New Growth Ventures, BOM and Innovation Industries. The company expects to add to this round and close it by the end of the year.

Morphotonics provides large-area nanoimprint systems, based on its unique roll-to-plate technology. The company's main markets are 3D displays and AR glasses. The company's technology can also be used as a flexible stamping system for microLED mass transfer.

During the company's recent conference call, AUO said that the company is undergoing a strategic transformation, focusing on mobility solutions, vertical solutions, and the display segment. The company gave several interesting statements regarding its microLED project and investments.

First of all, the company says that microLED is a priority for the company, and it plans to allocate more resources into its microLED projects. AUO says that its microLED technology is 'gaining traction', and that it is producing microLED displays commercially, but it did not detail more. The company believes it is the leader in microLED development.

MicroLED-Connect is the world's first dedicated MicroLED conference and exhibition. The event, organized by TechBlick and the MicroLED Association, will take place at the High Tech Campus in Eindhoven, also known as "the smartest square kilometer in all of Europe", and will include an excellent conference program, masterclasses, tours - with a special emphasis on social/professional gatherings and networking opportunities. Register now and enjoy a discounted rate (until August 16).

A major challenge for microLED production lies at the mass transfer process, in which LEDs have to be transferred from the processed epiwafer to the final display substrate. A good mass transfer process has to be quick, efficient, and accurate - not an easy feat to achieve. MicroLED-Connect will present ample opportunities to learn more about transfer technologies, the challenges, the different processes and the latest innovations.

Justin Brown is X Display's Executive Vice President for Operations & Equipment. Justin leads the company’s supply chain development, manufacturing partner relationships and also its Equipment division, which provides mass-transfer equipment for XDC’s partners and licensees. Justin was kind enough to answer a few questions we had for XDC.

Q: Hello Justin, thanks for your time. XDC has been a bit quiet in the last few years. Can you bring us up to date on your microLED technologies, processes and products?

Thank you for the opportunity to share the progress at XDC. We have been busier in the near past than ever before. As you know, we first announced our MicroIC technology, our mass transfer process, our manufacturing equipment and the uniqueness of our approach, the IP strength we possess and the experience of the team. This led to broad customer visibility and we narrowed down our efforts to a select set of partners that we are currently working with. We have deep engagements with customers that we anticipate will result in end product announcements in the future.

Toray Engineering announced a technical partnership with semiconductor test equipment supplier Advantest Corporation, to promote efficient combined production systems for miniLEDs and microLED displays.

Toray Engineering will able to offer a combined inspection, transfer, and mounting systems, by data linking its systems with Advantest's inspection equipment. The company says that these integrated systems will enable the acceleration of microLED R&D and production. 

We are happy to announce a new edition of our MicroLED Transfer Process Market Report, with all the latest information, new technologies and companies, and more. MicroLEDs are advancing quickly and the transfer process remains one of the key challenges. This report includes all the latest updates, including Apple's project cancellation (and its implications) and a new section on recent transfer related research activities.

Reading this report, you'll learn all about:

• All known microLED transfer processes
• The current industry and market status
• Advantages and disadvantages of transfer technologies
• Future technologies and roadmaps

The report package also provides:

• An introduction to microLED production processes
• Over 25 presentations, brochures and technical papers
• MicroLED chip-level market estimates and forecasts
• Free updates for a year

This microLED display transfer process report provides a comprehensive look into current and future LED transfer technologies processes used for the production of microLED displays. The report covers everything you need to know about the current status of the industry.